Introduction to Electromagnetic Compatibility E-Book

Clayton R. Paul

• Herausgeber: John Wiley & Sons
• Kategorie: Wissenschaft und neue Technologien
• Sprache: Englisch

Seitenzahl: 1264

Veröffentlichungsjahr: 2022

Beschreibung

INTRODUCTION TO ELECTROMAGNETIC COMPATIBILITY The revised new edition of the classic textbook is an essential resource for anyone working with today's advancements in both digital and analog devices, communications systems, as well as power/energy generation and distribution. Introduction to Electromagnetic Compatibility provides thorough coverage of the techniques and methodologies used to design and analyze electronic systems that function acceptably in their electromagnetic environment. Assuming no prior familiarity with electromagnetic compatibility, this user-friendly textbook first explains fundamental EMC concepts and technologies before moving on to more advanced topics in EMC system design. This third edition reflects the results of an extensive detailed review of the entire second edition, embracing and maintaining the content that has "stood the test of time", such as from the theory of electromagnetic phenomena and associated mathematics, to the practical background information on U.S. and international regulatory requirements. In addition to converting Dr. Paul's original SPICE exercises to contemporary utilization of LTSPICE, there is new chapter material on antenna modeling and simulation. This edition will continue to provide invaluable information on computer modeling for EMC, circuit board and system-level EMC design, EMC test practices, EMC measurement procedures and equipment, and more such as: * Features fully-worked examples, topic reviews, self-assessment questions, end-of-chapter exercises, and numerous high-quality images and illustrations * Contains useful appendices of phasor analysis methods, electromagnetic field equations and waves. The ideal textbook for university courses on EMC, Introduction to Electromagnetic Compatibility, Third Edition is also an invaluable reference for practicing electrical engineers dealing with interference issues or those wanting to learn more about electromagnetic compatibility to become better product designers.

Leseprobe

Table of Contents

Cover

Title Page

Copyright

Preface

CHAPTER ONE: Introduction to Electromagnetic Compatibility (EMC)

1.1 ASPECTS OF EMC

1.2 ELECTRICAL DIMENSIONS AND WAVES

1.3 DECIBELS AND COMMON EMC UNITS

1.4 SUMMARY

PROBLEMS

REFERENCES

CHAPTER TWO: EMC Requirements for Electronic Systems

2.1 GOVERNMENTAL REQUIREMENTS

2.2 ADDITIONAL PRODUCT REQUIREMENTS

2.3 DESIGN CONSTRAINTS FOR PRODUCTS

2.4 ADVANTAGES OF EMC DESIGN

PROBLEMS

REFERENCES

CHAPTER THREE: Signal Spectra––the Relationship between the Time Domain and the Frequency Domain

3.1 PERIODIC SIGNALS

3.2 SPECTRA OF DIGITAL WAVEFORMS

3.3 SPECTRUM ANALYZERS

3.4 REPRESENTATION OF NONPERIODIC WAVEFORMS

3.5 REPRESENTATION OF RANDOM (DATA) SIGNALS

PROBLEMS

REFERENCES

NOTES

CHAPTER FOUR: Transmission Lines and Signal Integrity

4.1 THE TRANSMISSION‐LINE EQUATIONS

4.2 THE PER‐UNIT‐LENGTH PARAMETERS

4.3 THE TIME‐DOMAIN SOLUTION

4.4 HIGH‐SPEED DIGITAL INTERCONNECTS AND SIGNAL INTEGRITY

4.5 SINUSOIDAL EXCITATION OF THE LINE AND THE PHASOR SOLUTION

4.6 LUMPED‐CIRCUIT APPROXIMATE MODELS

PROBLEMS

REFERENCES

CHAPTER FIVE: Nonideal Behavior of Components

5.1 WIRES

5.2 PRINTED CIRCUIT BOARD (PCB) LANDS

5.3 EFFECT OF COMPONENT LEADS

5.4 RESISTORS

5.5 CAPACITORS

5.6 INDUCTORS

5.7 FERROMAGNETIC MATERIALS—SATURATION AND FREQUENCY RESPONSE

5.8 FERRITE BEADS

5.9 COMMON‐MODE CHOKES

5.10 ELECTROMECHANICAL DEVICES

5.11 DIGITAL CIRCUIT DEVICES

5.12 EFFECT OF COMPONENT VARIABILITY

5.13 MECHANICAL SWITCHES

PROBLEMS

REFERENCES

CHAPTER SIX: Conducted Emissions and Susceptibility

6.1 MEASUREMENT OF CONDUCTED EMISSIONS

6.2 POWER SUPPLY FILTERS

6.3 POWER SUPPLIES

6.4 POWER SUPPLY AND FILTER PLACEMENT

6.5 CONDUCTED SUSCEPTIBILITY

PROBLEMS

REFERENCES

NOTE

CHAPTER SEVEN: Antennas

7.1 ELEMENTAL DIPOLE ANTENNAS

7.2 THE HALF‐WAVE DIPOLE AND QUARTER‐WAVE MONOPOLE ANTENNAS

7.3 ANTENNA ARRAYS

7.4 CHARACTERIZATION OF ANTENNAS

7.5 THE FRIIS TRANSMISSION EQUATION

7.6 EFFECTS OF REFLECTIONS

7.7 BROADBAND MEASUREMENT ANTENNAS

7.8 ANTENNA MODELING AND SIMULATION

PROBLEMS

REFERENCES

CHAPTER EIGHT: Radiated Emissions and Susceptibility

8.1 SIMPLE EMISSION MODELS FOR WIRES AND PCB LANDS

8.2 SIMPLE SUSCEPTIBILITY MODELS FOR WIRES AND PCB LANDS

PROBLEMS

REFERENCES

CHAPTER NINE: Crosstalk

9.1 THREE‐CONDUCTOR TRANSMISSION LINES AND CROSSTALK

9.2 THE TRANSMISSION‐LINE EQUATIONS FOR LOSSLESS LINES

9.3 THE PER‐UNIT‐LENGTH PARAMETERS

9.4 THE INDUCTIVE–CAPACITIVE COUPLING APPROXIMATE MODEL

9.5 SHIELDED WIRES

9.6 TWISTED WIRES

PROBLEMS

REFERENCES

CHAPTER TEN: Shielding

10.1 SHIELDING EFFECTIVENESS

10.2 SHIELDING EFFECTIVENESS: FAR‐FIELD SOURCES

10.3 SHIELDING EFFECTIVENESS: NEAR‐FIELD SOURCES

10.4 LOW‐FREQUENCY, MAGNETIC FIELD SHIELDING

10.5 EFFECTS OF APERTURES

PROBLEMS

REFERENCES

CHAPTER ELEVEN: System Design for EMC

11.1 CHANGING THE WAY WE THINK ABOUT ELECTRICAL PHENOMENA

11.2 WHAT DO WE MEAN BY THE TERM “GROUND”

11.3 PRINTED CIRCUIT BOARD (PCB) DESIGN

11.4 SYSTEM CONFIGURATION AND DESIGN

11.5 DIAGNOSTIC TOOLS

PROBLEM

REFERENCES

APPENDIX A: The Phasor Solution Method

A.1. SOLVING DIFFERENTIAL EQUATIONS FOR THEIR SINUSOIDAL, STEADY‐STATE SOLUTION

A.2. SOLVING ELECTRIC CIRCUITS FOR THEIR SINUSOIDAL, STEADY‐STATE RESPONSE

REFERENCE

APPENDIX B: The Electromagnetic Field Equations and Waves

B.1. VECTOR ANALYSIS

B.2. MAXWELL'S EQUATIONS

B.3. BOUNDARY CONDITIONS

B.4. SINUSOIDAL STEADY STATE

B.5. POWER FLOW

B.6. UNIFORM PLANE WAVES

B.7. STATIC (DC) ELECTROMAGNETIC FIELD RELATIONS—A SPECIAL CASE

PROBLEMS

REFERENCES

APPENDIX C: Computer Codes for Calculating the Per‐Unit‐Length (PUL) Parameters and Crosstalk of Multiconductor Transmission Lines

C.1. WIDESEP.FOR FOR COMPUTING THE PUL PARAMETER MATRICES OF WIDELY SPACED WIRES

C.2. RIBBON.FOR FOR COMPUTING THE PUL PARAMETER MATRICES OF RIBBON CABLES

C.3. PCB.FOR FOR COMPUTING THE PUL PARAMETER MATRICES OF PRINTED CIRCUIT BOARDS

C.4. MSTRP.FOR FOR COMPUTING THE PUL PARAMETER MATRICES OF COUPLED MICROSTRIP LINES

C.5. STRPLINE.FOR FOR COMPUTING THE PUL PARAMETER MATRICES OF COUPLED STRIPLINES

APPENDIX D: A SPICE (PSPICE, LTSPICE, etc.) Tutorial and Applications Guide

D.1 CREATING A SPICE OR PSPICE SIMULATION

D.2 CREATING AN LTSPICE SIMULATION

D.3 LUMPED‐CIRCUIT APPROXIMATE MODELS

D.4 AN EXACT SPICE (PSPICE) MODEL FOR LOSSLESS, COUPLED LINES

D.5 USE OF SPICE (PSPICE) IN FOURIER ANALYSIS

D.6 SPICEMTL.FOR FOR COMPUTING A SPICE (PSPICE) SUBCIRCUIT MODEL OF A LOSSLESS, MULTICONDUCTOR TRANSMISSION LINE

D.7 SPICELPI.FOR FOR COMPUTING A SPICE (PSPICE) SUBCIRCUIT OF A LUMPED‐PI MODEL OF A LOSSLESS, MULTICONDUCTOR TRANSMISSION LINE

PROBLEMS

REFERENCES

APPENDIX E: A Brief History of Electromagnetic Compatibility

E.1. HISTORY OF EMC

E.2. EXAMPLES

INDEX

End User License Agreement

List of Tables

Chapter 1

TABEL 1.1 Frequencies of Sinusoidal Waves and Their Corresponding Wavelength...

TABEL 1.2 Frequencies and Corresponding Wavelengths of Electronic Systems

TABEL 1.3 Relative Permittivities of Various Dielectrics

TABEL 1.4 Relative Permeabilities and Conductivities (Relative to Copper) of...

TABEL 1.5 Conversion to Decibels

Chapter 2

TABLE 2.1 FCC and CISPR 32 Conducted Emission Limits for Class B Digital Dev...

TABLE 2.2 FCC and CISPR 32 Conducted Emission Limits for Class A Digital Dev...

TABLE 2.3 Upper Limit of Measurement Frequency

TABLE 2.4 FCC Emission Limits for Class B Digital Devices

TABLE 2.5 FCC Emission Limits for Class A Digital Devices

TABLE 2.6 CISPR 32 Radiated Emission Limits for Class B ITE Equipment (10 m)...

TABLE 2.7 CISPR 32 Radiated Emission Limits for Class A ITE Equipment (10 m)...

TABLE 2.8 Emission and Susceptibility Requirements of MIL‐STD‐461G

TABLE 2.9 Requirement Matrix of MIL‐STD‐461G

a

TABLE 2.10 RS103 Limits

a

Chapter 3

TABLE 3.1 FCC Minimum Spectrum Analyzer Bandwidths (6 dB)

TABLE 3.2 CISPR 32 Minimum Spectrum Analyzer Bandwidths (6 dB)

TABLE 3.3 The Effect of the Addition of Two Unequal Level Signals

Chapter 4

TABLE 4.1 Effects of the Signs of the Reflection Coefficients on the Load Vo...

Chapter 5

TABLE 5.1 Conductivities (Relative to Copper) and Permeabilities (Relative t...

TABLE 5.2 Wire Gauges (AWG) and Wire Diameters

TABLE 5.3 Relative Permittivities of Insulation Dielectrics

TABLE 5.4 Skin Depth of Copper

Chapter 6

TABLE 6.1 LISN Element Impedances as a Function of Frequency

Chapter 8

TABLE 8.1

I

probe

versus Position on Cable (

f

 = 100 MHz)

Chapter 9

TABLE 9.1

The Transmission‐Line Capacitances for the Three‐Wire Ribbon Cable

...

TABLE 9.2

The Transmission‐Line Inductances for the Three‐Wire Ribbon Cable

...

Chapter 10

TABLE 10.1

Relative Conductivity and Permeability, and Approximate Absorptio

...

Chapter 11

TABLE 11.1

Results of (11.23) as

d

 → ∞

TABLE 11.2

The Triboelectric Series

Appendix B

TABLE B.1 Skin Depth of Copper

TABLE B.2 Maxwell's Equations for Static (dc) Fields

Appendix D

TABLE D.1

Multipliers and the Corresponding SPICE Symbols

TABLE D.2

Fourier Components of Transient Response V(1)

TABLE D.3 Fourier Components of Transient Response V(1)

TABLE D.4 Fourier Components of Transient Response V(2)

TABLE D.5 Fourier Components of Transient Response V(1)

TABLE D.6 Fourier Components of Transient Response V(1)

TABLE D.7 Fourier Components of Transient Response V(1)

TABLE D.8 Fourier Components of Transient Response V(1)

List of Illustrations

Chapter 1

FIGURE 1.1 The basic decomposition of the EMC coupling problem.

FIGURE 1.2 The four basic EMC subproblems: (a) radiated emissions; (b) radia...

FIGURE 1.3 Other aspects of EMC: (a) electrostatic discharge (ESD); (b) elec...

FIGURE 1.4 Illustration of the effect of element interconnection leads.

FIGURE 1.5 Wave propagation: (a) wave propagation in space and wavelength; (...

FIGURE 1.6 An illustration of the definition and use of the decibel (dB).

FIGURE 1.7 An illustration of the use of the decibel in computing amplifier ...

FIGURE 1.8 Specification of a signal source as a Thevenin equivalent circuit...

FIGURE 1.9 An equivalent circuit for the input to a signal measurer.

FIGURE 1.10 Use of coaxial cables with matched loads to connect a signal sou...

FIGURE 1.11 Calculation of a signal source output for a mismatched load.

Chapter 2

FIGURE 2.1 The FCC and CISPR 32 conducted emission limits: (a) Class B; (b) ...

FIGURE 2.2 FCC radiated emission limits: (a) Class B; (b) Class A.

FIGURE 2.3 A comparison of the FCC Class A and FCC Class B radiated emission...

FIGURE 2.4 The CISPR 32 radiated emission limits compared to the FCC radiate...

FIGURE 2.5 MIL‐STD‐461G CE102 limit (EUT power leads, ac and dc) for all app...

FIGURE 2.6 (a) MIL‐STD‐461G RE102 limit for aircraft and space system applic...

FIGURE 2.7 Illustration of the use of a semianechoic chamber for the measure...

FIGURE 2.8 Illustration of a typical test of a digital device for its radiat...

FIGURE 2.9 A typical household power distribution system in the United State...

FIGURE 2.10 The line impedance stabilization network (LISN) for the measurem...

FIGURE 2.11 LISN element values for (a) FCC and CISPR 32 and (b) MIL‐STD‐461...

FIGURE 2.12 Radiated emissions of a typical digital product: (a) vertical em...

FIGURE 2.13 Conducted emissions of a typical digital product containing a sw...

FIGURE 2.14 A simple experiment to demonstrate the difficulty in complying w...

FIGURE 2.15 Radiated emissions at 3 m for the device of Fig. 2.15: (a) horiz...

FIGURE P2.1.7

FIGURE P2.1.11

FIGURE P2.1.12

Chapter 3

FIGURE 3.1 A periodic signal with period T.

FIGURE 3.2 A nonperiodic signal.

FIGURE 3.3 Processing of a signal by a linear system: (a) input

x

(

t

) produce...

FIGURE 3.4 A periodic “square wave” pulse train.

FIGURE 3.5 Frequency‐domain representation of a square wave; (a) the signal;...

FIGURE 3.6 Illustration of the decomposition of a square wave into its frequ...

FIGURE 3.7 Example 3.1 .

FIGURE 3.8 Illustration of the complete response to a general time‐domain si...

FIGURE 3.9 Example 3.2 illustrating computation of the steady‐state respons...

FIGURE 3.10 Illustration of the principle of linear decomposition of a signa...

FIGURE 3.11 Illustration of the time‐shift principle: (a)

x

(

t

); (b) x(t − α)...

FIGURE 3.12 The impulse function.

FIGURE 3.13 A periodic train of unit impulses (a) and (b) shifted in time.

FIGURE 3.14 Example 3.3 .

FIGURE 3.15 Example 3.4 illustrating the use of differentiation to compute ...

FIGURE 3.16 The periodic, trapezoidal pulse train representing clock and dat...

FIGURE 3.17 Various derivatives of the trapezoidal pulse train: (a) first de...

FIGURE 3.18 Bounds on the (sin 

x

) / 

x

function.

FIGURE 3.19 Bounds on the one‐sided magnitude spectrum of a trapezoidal puls...

FIGURE 3.20 Examples illustrating the spectral bounds for various duty cycle...

FIGURE 3.21 Experimentally measured spectra of a 1 V, 10 MHz, 50%‐duty‐cycle...

FIGURE 3.22 Illustration of interpolation on log–log (Bode) plots: (a) the g...

FIGURE 3.23 Example 3.5 illustrating the effect of rise/falltimes and repet...

FIGURE 3.24 Reconstruction of a 5 V, 100 MHz, 1 ns rise/falltime, 50%‐duty‐c...

FIGURE 3.25 Illustration of the effect of duty cycle on the spectral bounds ...

FIGURE 3.26 Illustration of ringing (undershoot/overshoot): (a) time‐domain ...

FIGURE 3.27 Illustration of the estimation of processing of a signal by line...

FIGURE E3.5 Review Exercise 3.5.

FIGURE 3.28 A spectrum analyzer: (a) photograph (courtesy of the Hewlett‐Pac...

FIGURE 3.29 Illustration of the effect of bandwidth on measured spectrum: (a...

FIGURE 3.30 Two important detectors: (a) the peak detector and (b) the quasi...

FIGURE 3.31 The Fourier transform of a rectangular pulse: (a) the pulse; (b)...

FIGURE E3.6 Review Exercise 3.6.

FIGURE 3.32 Illustration of the computation of the power spectral density of...

FIGURE 3.33 The power spectral density of the PCM–NRZ signal.

FIGURE P3.1.1

FIGURE P3.1.2

FIGURE P3.1.3

FIGURE P3.1.4

FIGURE P3.1.5

FIGURE P3.1.6

FIGURE P3.1.7

FIGURE P3.1.8

FIGURE P3.1.9

FIGURE P3.1.10

FIGURE P3.2.1

FIGURE P3.2.2

FIGURE P3.2.3

FIGURE P3.2.4

FIGURE P3.2.6

FIGURE P3.2.7

Chapter 4

FIGURE 4.1 Illustration of typical wire‐type transmission lines: (a) two wir...

FIGURE 4.2 Illustration of typical printed circuit board (PCB) structures: (...

FIGURE 4.3 The two‐conductor transmission line: (a) electric field about a t...

FIGURE 4.4 The per‐unit‐length equivalent circuit of a transmission line.

FIGURE 4.5 The magnetic field about a current‐carrying wire.

FIGURE 4.6 Illustration of a basic subproblem of determining the magnetic fl...

FIGURE 4.7 The electric field about a charge‐carrying wire.

FIGURE 4.8 Illustration of a basic subproblem of determining the voltage bet...

FIGURE 4.9 Determination of the per‐unit‐length parameters of a two‐wire lin...

FIGURE 4.10 Determination of the per‐unit‐length capacitance of a wire above...

FIGURE 4.11 Determination of the per‐unit‐length parameters of a coaxial cab...

FIGURE 4.12 Cross‐sectional dimensions of lines composed of rectangular cros...

FIGURE 4.13 Reflection of waves at a termination.

FIGURE 4.14 The equivalent circuit seen at the input to a line before the wa...

FIGURE 4.15 An example to illustrate sketching the voltage on a line as a fu...

FIGURE 4.16 An example to illustrate sketching the voltage and current at th...

FIGURE 4.17 Example 4.3 . Illustration of the effect of pulsewidth on the te...

FIGURE 4.18 Example 4.4 . Illustration of the effect of pulsewidth on the te...

FIGURE 4.19 The “bounce diagram” for determining the voltages on the line at...

FIGURE 4.20 The exact model of a transmission line.

FIGURE 4.21 Illustration of “clock skew” caused by unequal propagation paths...

FIGURE 4.22 A typical digital application of transmission lines: (a) the lin...

FIGURE 4.23 Illustration of the phenomenon of “ringing” in transmission line...

FIGURE 4.24 Illustration of the solution for a line terminated in a capaciti...

FIGURE 4.25 Illustration of the solution for a line terminated in an inducti...

FIGURE 4.26 The series match for matching a transmission line: (a) implement...

FIGURE 4.27 The parallel match for matching a transmission line: (a) impleme...

FIGURE 4.28 Determining when “the line doesn't matter”: (a) the circuit and ...

FIGURE 4.29 Illustration of line discontinuities caused by different charact...

FIGURE 4.30 Example 4.5 : (a) problem specification; (b) the voltage at the ...

FIGURE 4.31 Example 4.6 . A line with a discontinuity that is matched at the...

FIGURE 4.32 Effects of feeding multiple lines: (a) series distribution; (b) ...

FIGURE 4.33 Matching a series distribution at the line midpoint: a mistake t...

FIGURE 4.34 Analysis of the parallel distribution of Fig. 4.32b.

FIGURE 4.35 Definition of terms for the sinusoidal steady‐state (phasor) ana...

FIGURE 4.36 Example 4.7 . An example illustrating the phasor analysis of tra...

FIGURE 4.37 The per‐unit‐length equivalent circuit of a two‐conductor lossy ...

FIGURE 4.38 Illustration of skin effect: (a) wires; (b) PCB lands.

FIGURE 4.39 Frequency response of the per‐unit‐length resistance of wires.

FIGURE 4.40 Illustration of bound charge dipoles in dielectrics and their ro...

FIGURE 4.41 Frequency dependence of the characteristic impedance of a lossy ...

FIGURE 4.42 Frequency dependence of parameters of a lossy stripline; (a) att...

FIGURE 4.43 Modeling the transmission line with lumped circuits: (a) problem...

FIGURE P4.1.1

FIGURE P4.3.1

FIGURE P4.3.2

FIGURE P4.3.3

FIGURE P4.3.4

FIGURE P4.3.6

FIGURE P4.3.7

FIGURE P4.4.2

FIGURE P4.5.6

Chapter 5

FIGURE 5.1 Illustration of the dependence of the per‐unit‐length resistance ...

FIGURE 5.2 Illustration of the dependence of the per‐unit‐length internal in...

FIGURE 5.3 A pair of parallel wires to be modeled with an equivalent circuit...

FIGURE 5.4 Lumped equivalent circuits for a pair of parallel wires: (a) lump...

FIGURE 5.5 Illustration of skin effect for PCB lands.

FIGURE 5.6 Modeling the effect of magnetic fields of component leads: (a) ph...

FIGURE 5.7 Modeling the effect of electric fields of component leads: (a) ph...

FIGURE 5.8 Equivalent circuits of component leads: (a) distributed parameter...

FIGURE 5.9 Frequency behavior of the impedance of an ideal resistor: (a) mag...

FIGURE 5.10 The nonideal resistor including the effects of the leads: (a) eq...

FIGURE 5.11 Simplification of the equivalent circuit of a resistor for vario...

FIGURE 5.12 Measured impedance of a 1000 Ω carbon resistor having 1

2 i...

FIGURE 5.13 Frequency response of the impedance of an ideal capacitor: (a) m...

FIGURE 5.14 Modeling of a physical capacitor with an equivalent circuit.

FIGURE 5.15 A simplified equivalent circuit of a capacitor including the eff...

FIGURE 5.16 Measured impedance of a 470 pF ceramic capacitor with short lead...

FIGURE 5.17 Measured impedance of a 470 pF ceramic capacitor with 1/2 in. le...

FIGURE 5.18 Measured impedance of a 0.15 μF tantalum capacitor with short le...

FIGURE 5.19 Measured impedance of a 0.15 μF tantalum capacitor with 1/2 in. ...

FIGURE 5.20 An important consideration in the diversion of currents with a p...

FIGURE 5.21 Frequency response of the impedance of an ideal inductor: (a) ma...

FIGURE 5.22 A simplified equivalent circuit of an inductor including the eff...

FIGURE 5.23 Measured impedance of a 1.2 μH inductor: (a) magnitude; (b) phas...

FIGURE 5.24 An important consideration in the blocking of currents with a se...

FIGURE 5.25 (a) The nonlinear relationship between magnetic flux density and...

FIGURE 5.26 Frequency response of the relative permeabilities of MnZn and Ni...

FIGURE 5.27 Measured impedances of inductors formed by winding 5 turns of 28...

FIGURE 5.28 Photos of various configurations of ferrites for various applica...

FIGURE 5.29 A ferrite bead.

FIGURE 5.30 A multiturn ferrite bead.

FIGURE 5.31 Measured impedances of (a) a 1

2‐turn ferrite bead and (b) a 2 1...

FIGURE 5.32 Decomposition of the currents on a two‐wire transmission line in...

FIGURE 5.33 Illustration of the relative radiated emission potential of (a) ...

FIGURE 5.34 Modeling the effect of a common‐mode choke on (a) the currents o...

FIGURE 5.35 (a) A simple way of winding a common‐mode choke; (b) parasitic c...

FIGURE 5.36 A dc motor illustrating (a) physical construction, (b) brushes a...

FIGURE 5.37 Illustration of (a) an H‐drive circuit and (b) conversion of com...

FIGURE 5.38 A typical driver circuit for a stepper motor.

FIGURE 5.39 Illustration of the voltage–current characteristic of arcing at ...

FIGURE 5.40 The breakdown voltage versus contact separation for a mechanical...

FIGURE 5.41 The showering arc for an inductive load.

FIGURE 5.42 Contact protection by reducing the circuit available voltage.

FIGURE 5.43 Various contact protection schemes: (a) capacitor; (b)

RC

, (c) R...

FIGURE 5.44 Diode protection for an inductive load: (a) bypass configuration...

FIGURE P5.4.1

FIGURE P5.4.2

FIGURE P5.4.3

FIGURE P5.4.5

FIGURE P5.4.6

FIGURE P5.4.7

FIGURE P5.9.1

FIGURE P5.9.2

FIGURE P5.10.1

Chapter 6

FIGURE 6.1 Illustration of the use of a line impedance stabilization network...

FIGURE 6.2 Illustration of the LISN circuit.

FIGURE 6.3 Equivalent circuit of the LISN as seen by the product over the co...

FIGURE 6.4 Illustration of the contributions of differential‐mode and common...

FIGURE 6.5 Methods of reducing the common‐mode contribution to conducted emi...

FIGURE 6.6 Definition of the insertion loss of a filter: (a) load voltage wi...

FIGURE 6.7 Four simple filters: (a) low pass; (b) high pass; (c) band pass; ...

FIGURE 6.8 Insertion loss tests: (a) differential mode; (b) common mode.

FIGURE 6.9 A typical power supply filter topology.

FIGURE 6.10 Use of a common‐mode choke to block common‐mode conducted emissi...

FIGURE 6.11 The equivalent circuit of the filter and LISN for common‐mode cu...

FIGURE 6.12 The equivalent circuit of the filter and LISN for differential‐m...

FIGURE 6.13 Illustration of the important observation that one component of ...

FIGURE 6.14 Schematic of a device to separate the common‐mode and differenti...

FIGURE 6.15 Photograph of the device of Fig. 6.14.

FIGURE 6.16 Measured conducted emissions of a typical digital product separa...

FIGURE 6.17 Measured conducted emissions of a typical digital product separa...

FIGURE 6.18 Measured conducted emissions of a typical digital product separa...

FIGURE 6.19 Measured conducted emissions of a typical digital product separa...

FIGURE 6.20 Measured conducted emissions of a typical digital product separa...

FIGURE 6.21 Illustration of a linear, regulated power supply.

FIGURE 6.22 A simple “buck regulator” switching power supply.

FIGURE 6.23 A typical “flyback” or primary‐side switching power supply.

FIGURE 6.24 Illustration of nonideal effects in diodes: (a) various recovery...

FIGURE 6.25 Construction of transformers: (a) transformer schematic; (b) a 6...

FIGURE 6.26 Illustration of the effect of primary‐to‐secondary capacitance o...

FIGURE 6.27 Illustration of (a) poor filter placement and (b) proper filter ...

FIGURE P6.1.1

FIGURE P6.2.1

Chapter 7

FIGURE 7.1 The electric (Hertzian) dipole.

FIGURE 7.2 The magnetic dipole (loop).

FIGURE 7.3 Illustration of (a) the dipole antenna and (b) the monopole anten...

FIGURE 7.4 Computation of the radiated fields of the dipole antenna: (a) tre...

FIGURE 7.5 Radiated electric field patterns of dipoles: (a) a dipole whose l...

FIGURE 7.6 The radiation resistance and reactance of a dipole antenna as a f...

FIGURE 7.7 Representation of the input impedance to an antenna: (a) the inpu...

FIGURE 7.8 An example illustrating the computation of the radiated power of ...

FIGURE 7.9 Calculation of the radiated electric field of an array of two ant...

FIGURE 7.10 Example 7.4 . The pattern of an array of two isotropic sources s...

FIGURE 7.11 Example 7.5 . The pattern of an array of two isotropic sources s...

FIGURE 7.12 Example 7.6 . The pattern of an array of two isotropic sources s...

FIGURE 7.13 Illustration of the meaning of antenna directivity: (a) the isot...

FIGURE 7.14 Receiving properties of antennas: (a) illustration of effective ...

FIGURE 7.15 Example 7.9 . Illustration of the computation of the maximum eff...

FIGURE 7.16 The antenna factor (AF): (a) general circuit; (b) equivalent cir...

FIGURE 7.17 The antenna factor versus frequency for a typical biconical EMC ...

FIGURE 7.18 Example 7.10 . An example illustrating the use of the antenna fa...

FIGURE 7.19 Use of baluns to reduce common‐mode currents on antennas: (a) us...

FIGURE 7.20 Other methods of reducing common‐mode currents: (a) use of ferri...

FIGURE 7.21 Use of pads to match transmission lines: (a) a pi pad structure....

FIGURE 7.22 Illustration of the Friis transmission equation for computing th...

FIGURE 7.23 Illustration of the method of images for charges and currents ab...

FIGURE 7.24 A uniform plane wave with incidence normal to the interface betw...

FIGURE 7.25 The total (incident plus reflected) fields for a uniform plane w...

FIGURE 7.26 Illustration of the problem of communication between two antenna...

FIGURE 7.27 Illustration of the determination of the reflection coefficients...

FIGURE 7.28 Determination of the reflected wave correction factor for the FC...

FIGURE 7.29 The infinite biconical antenna.

FIGURE 7.30 (a) The truncated biconical antenna composed of wire elements; (...

FIGURE 7.31 Other implementations of truncated biconical antennas: (a) the d...

FIGURE 7.32 Log‐periodic antennas: (a) periodicity of the structure; (b) non...

FIGURE 7.33 Practical feed of a log‐periodic antenna.

FIGURE 7.34 A photograph of a log‐periodic antenna used in compliance testin...

FIGURE P7.4.7

Chapter 8

FIGURE 8.1 Illustration of the relative effects of differential‐mode current...

FIGURE 8.2 Calculation of the far fields of the wire currents.

FIGURE 8.3 A simplified estimate of the maximum radiated emissions due to di...

FIGURE 8.4 Illustration of the radiated emissions due to the differential‐mo...

FIGURE 8.5 Illustration of the observation that (a) the fields of differenti...

FIGURE 8.6 Common mistakes that lead to unnecessarily large differential‐mod...

FIGURE 8.7 A simplified estimate of the maximum radiated emissions due to co...

FIGURE 8.8 Illustration of the radiated emissions due to the common‐mode cur...

FIGURE 8.9 The current probe: (a) illustration of Ampere

'

s law; (b) use ...

FIGURE 8.10 (a) Photograph of a current probe and (b) its measured transfer ...

FIGURE 8.11 Illustration of the preparation of a diagram to be used with a c...

FIGURE 8.12 An experiment to assess the importance of common‐mode currents o...

FIGURE 8.13 Physical dimensions of the measurement site, including the effec...

FIGURE 8.14 Measured common‐mode current spectral content at the center of t...

FIGURE 8.15 Measured and predicted emissions of the device of Fig. 8.12.

FIGURE 8.16 Measured and predicted emissions of the device of Fig. 8.12, wit...

FIGURE 8.17 Measured and predicted emissions of the device of Fig. 8.12 with...

FIGURE 8.18 An experiment illustrating common‐mode currents on PCBs: (a) dev...

FIGURE 8.19 Measured and predicted emissions of the device of Fig. 8.18.

FIGURE 8.20 Measured and predicted emissions of the device of Fig. 8.18, wit...

FIGURE 8.21 Modeling a two‐conductor line to determine the terminal voltages...

FIGURE 8.22 Illustration of the derivation of the parallel current source.

FIGURE 8.23 A simplified, lumped equivalent circuit of the pickup of inciden...

FIGURE 8.24 An example illustrating the computation of induced voltages for ...

FIGURE 8.25 An example illustrating the computation of induced voltages for ...

FIGURE 8.26 Illustration of the effect of the direction of incidence of the ...

FIGURE 8.27 Illustration of the application of principles described above to...

FIGURE 8.28 Use of a conductive plate behind and close to an electronics boa...

FIGURE 8.29 Measured and predicted results for incident field pickup of a tw...

FIGURE 8.30 Illustration of incident field pickup for a shielded cable.

FIGURE 8.31 The surface transfer impedance of a cylinder as a function of th...

FIGURE 8.32 The equivalent circuit of the interior of a coaxial cable for co...

FIGURE P8.1.1

FIGURE P8.1.2

FIGURE P8.1.3

FIGURE P8.1.4

FIGURE P8.1.5

FIGURE P8.1.6

FIGURE P8.1.8

FIGURE P8.2.3

FIGURE P8.2.5

FIGURE P8.2.9

Chapter 9

FIGURE 9.1 The general three‐conductor transmission line, illustrating cross...

FIGURE 9.2 Wire‐type line cross sections whose reference conductors are (a) ...

FIGURE 9.3 Printed circuit board line cross sections: (a) coupled stripline ...

FIGURE 9.4 The per‐unit‐length equivalent circuit of a three‐conductor trans...

FIGURE 9.5 Illustration of two important subproblems for computing the per‐u...

FIGURE 9.6 Computation of the per‐unit‐length inductances for three‐wire lin...

FIGURE 9.7 Computation of the per‐unit‐length coefficients of potential for ...

FIGURE 9.8 Computation of the per‐unit‐length inductances for a ribbon cable...

FIGURE 9.9 Computation of the per‐unit‐length inductances for two wires abov...

FIGURE 9.10 Computation of the per‐unit‐length inductances for two wires wit...

FIGURE 9.11 Illustration of proximity effect for closely spaced wires; (a) r...

FIGURE 9.12 Calculation of the capacitance of a parallel‐plate capacitor: (a...

FIGURE 9.13 Approximating the charge distribution on the plates of a paralle...

FIGURE 9.14 Illustration of the method of moments (MoM) for numerical soluti...

FIGURE 9.15 Plot of the capacitance of a parallel‐plate capacitor obtained f...

FIGURE 9.16 A five‐wire ribbon cable illustrating typical dimensions.

FIGURE 9.17 Representation of dielectric with bound charge: (a) illustration...

FIGURE 9.18 A printed circuit board (PCB) for illustration of the determinat...

FIGURE 9.19 Illustration of peaking of the charge distribution at the edges ...

FIGURE 9.20 Illustration of the pulse expansion of a charge distribution on ...

FIGURE 9.21 Calculation of the potential due to a constant charge distributi...

FIGURE 9.22 Calculation of the contribution to the potential at a point due ...

FIGURE 9.23 A PCB consisting of identical conductors with identical separati...

FIGURE 9.24 Explanation of the two components of crosstalk: (a) magnetic fie...

FIGURE 9.25 The simplified inductive–capacitive coupling crosstalk model: (a...

FIGURE 9.26 Frequency response of the crosstalk transfer function.

FIGURE 9.27 Effect of load impedance on the dominance of either inductive or...

FIGURE 9.28 Illustration of common‐impedance coupling due to nonzero impedan...

FIGURE 9.29 An experiment illustrating crosstalk using a ribbon cable.

FIGURE 9.30 Frequency response of the near‐end crosstalk for the ribbon cabl...

FIGURE 9.31 An experiment illustrating crosstalk using a printed circuit boa...

FIGURE 9.32 Frequency response of the near‐end crosstalk for the printed cir...

FIGURE 9.33 The simple inductive–capacitive coupling model of the receptor c...

FIGURE 9.34 Time‐domain crosstalk prediction of the inductive–capacitive cou...

FIGURE 9.35 Bounds on the spectrum of a periodic, trapezoidal pulse train. (...

FIGURE 9.36 Frequency response of the simple inductive–capacitive coupling m...

FIGURE 9.37 Output crosstalk spectrum as the sum of the trapezoidal pulse tr...

FIGURE 9.38 The time‐domain, near‐end crosstalk for the ribbon cable of Fig....

FIGURE 9.39 The time‐domain, near‐end crosstalk for the ribbon cable of Fig....

FIGURE 9.40 Measured near‐end crosstalk waveforms for the printed circuit bo...

FIGURE 9.41 Measured near‐end crosstalk waveforms for the printed circuit bo...

FIGURE 9.42 Adding a shield around the receptor circuit wire to reduce cross...

FIGURE 9.43 Calculation of the per‐unit‐length self‐inductances of the shiel...

FIGURE 9.44 The cross‐sectional capacitance equivalent circuit for the shiel...

FIGURE 9.45 A lumped equivalent circuit for capacitive coupling for the shie...

FIGURE 9.46 Illustration of the effect of placing a shield around a receptor...

FIGURE 9.47 A lumped equivalent circuit for inductive coupling for the shiel...

FIGURE 9.48 Illustration of the effect of shield grounding on the inductive ...

FIGURE 9.49 An experiment to illustrate the effect of shield grounding on cr...

FIGURE 9.50 Measured near‐end crosstalk for the configuration of Fig. 9.49 f...

FIGURE 9.51 Explanation of the effect of shield grounding in the experimenta...

FIGURE 9.52 Illustration of “pigtails” used to terminate shields in a cable ...

FIGURE 9.53 An approximate method of computing the effect of pigtails on cro...

FIGURE 9.54 An experiment to illustrate the effect of pigtail lengths on cro...

FIGURE 9.55 Experimental results for the configuration of Fig. 9.54 for pigt...

FIGURE 9.56 The near‐end crosstalk for the configuration of Fig. 9.54 for 8 ...

FIGURE 9.57 Frequency response of crosstalk for no shields, one shield (on t...

FIGURE 9.58 Cross section of an experiment to illustrate the effect of placi...

FIGURE 9.59 Experimental results for

R

 = 50 Ω and 8...

FIGURE 9.60 Predictions of the transmission‐line model versus experimental r...

FIGURE 9.61 Illustration of the effect of a twisted pair of receptor wires o...

FIGURE 9.62 A simple “abrupt loop” model of a twisted pair of receptor circu...

FIGURE 9.63 The simple inductive–capacitive coupling model for the twisted p...

FIGURE 9.64 Illustration of the per‐unit‐length mutual inductance to a twist...

FIGURE 9.65 Cross‐sectional dimensions of a twisted receptor wire pair for c...

FIGURE 9.66 The per‐unit‐length capacitances for a twisted receptor pair.

FIGURE 9.67 The simple inductive–capacitive coupling model of a twisted rece...

FIGURE 9.68 “Untwisting” the model of Fig. 9.67.

FIGURE 9.69 Terminating a twisted pair: (a) unbalanced terminations; (b) bal...

FIGURE 9.70 A simplified model for the unbalanced receptor wire pair: (a) ph...

FIGURE 9.71 The inductive–capacitive coupling model for the unbalanced twist...

FIGURE 9.72 Explanation of the effect of twist on crosstalk to an unbalanced...

FIGURE 9.73 The three levels of reducing inductive crosstalk: (a) single‐rec...

FIGURE 9.74 An experiment to illustrate the effect of a twisted pair on cros...

FIGURE 9.75 Cross‐sectional dimensions for the experiment of Fig. 9.74: (a) ...

FIGURE 9.76 Experimental results for the experiment of Fig. 9.74, comparing ...

FIGURE 9.77 Explanation of the results of Fig. 9.76 in terms of inductive an...

FIGURE 9.78 Experimental results for the experiment of Fig. 9.74 obtained by...

FIGURE 9.79 The inductive–capacitive coupling model for a twisted receptor w...

FIGURE 9.80 Explanation of the effect of balanced versus unbalanced terminat...

FIGURE P9.3.4

FIGURE P9.4.4

FIGURE P9.4.12

FIGURE P9.6.1

Chapter 10

FIGURE 10.1 Illustration of the use of a shielded enclosure: (a) to contain ...

FIGURE 10.2 Important practical considerations that seriously degrade shield...

FIGURE 10.3 Illustration of the effect of apertures in a shield (illustratio...

FIGURE 10.4 Illustration of the shielding effectiveness of a conducting barr...

FIGURE 10.5 Illustration of multiple reflections within a shield.

FIGURE 10.6 Approximate calculation of shielding effectiveness for uniform p...

FIGURE 10.7 Illustration of the effect of multiple reflections within the ba...

FIGURE 10.8 Shielding effectiveness of a 20‐mil thickness of copper.

FIGURE 10.9 Shielding effectiveness of a 20‐mil thickness of steel (SAE 1045...

FIGURE 10.10 Wave impedance of (a) the electric (Hertzian) dipole and (b) th...

FIGURE 10.11 Reflection loss of near‐field electric and magnetic sources [3]...

FIGURE 10.12 Two important methods of shielding against low‐frequency magnet...

FIGURE 10.13 Illustration of the frequency dependence of various ferromagnet...

FIGURE 10.14 Illustration of the important phenomenon of saturation of ferro...

FIGURE 10.15 Use of the shorted‐turn effect (bands) to reduce the radiated m...

FIGURE 10.16 Illustration of the effects of slots on induced currents on shi...

FIGURE 10.17 Illustration of the effects of slots at doors and covers: (a) t...

FIGURE 10.18 Use of the waveguide‐below‐cutoff principle to provide ventilat...

FIGURE P10.3

Chapter 11

FIGURE 11.1 Packaging considerations that affect radiated and conducted emis...

FIGURE 11.2 Illustration of the inadvertent coupling between PCBs due to the...

FIGURE 11.3 Having a “plan B” to reduce the spectral content of a clock if n...

FIGURE 11.4 Illustration of the impedance of a wire or PCB land.

FIGURE 11.5 Configuration considerations: (a) proximity of input and output ...

FIGURE 11.6 Illustration of the principle that signals may not return throug...

FIGURE 11.7 Reduction of the effectiveness of a shielded enclosure by a cabl...

FIGURE 11.8 Illustration of the effect of the Centronics parallel‐port print...

FIGURE 11.9 Illustration of common‐impedance coupling.

FIGURE 11.10 Illustration of the effect of conductor inductance on ground vo...

FIGURE 11.11 Residential power distribution in the United States.

FIGURE 11.12 Illustration of power cord connections for (a) a three‐wire pro...

FIGURE 11.13 Illustration of the effect on radiated emissions of providing a...

FIGURE 11.14 Illustration of the decomposition of loop inductance into parti...

FIGURE 11.15 Illustration of the definition of partial inductances: (a) self...

FIGURE 11.16 Calculation of partial inductances for wires: (a) self and (b) ...

FIGURE 11.17 Relating the transmission‐line loop inductance of a pair of par...

FIGURE 11.18 Illustration of the important principle that currents return to...

FIGURE 11.19 Effect of a ground grid on the return path of a signal.

FIGURE 11.20 Illustration of the fact that return currents will concentrate ...

FIGURE 11.21 Determination of the return current distribution on the ground ...

FIGURE 11.22 Effect of a slot in a ground plane showing that the return curr...

FIGURE 11.23 Effect of providing dedicated returns close to the “going‐down”...

FIGURE 11.24 Use of interspersed grounds (returns) on backplanes and in ribb...

FIGURE 11.25 Effect of providing returns symmetrically about the “going‐down...

FIGURE 11.26 Illustration of the problems in single‐point grounds: (a) commo...

FIGURE 11.27 Illustration of multipoint grounding: (a) the ideal case; (b) i...

FIGURE 11.28 A way of creating a single‐end grounded shield at low frequenci...

FIGURE 11.29 Hybrid ground schemes: (a) single‐point at low frequencies and ...

FIGURE 11.30 Segregation of grounds: (a) the ideal arrangement; (b) PCB layo...

FIGURE 11.31 Illustration of the generation of common‐mode currents on inter...

FIGURE 11.32 Use of a common‐mode choke to block common mode currents on int...

FIGURE 11.33 Methods for decoupling subsystems: (a) the optical isolator; (b...

FIGURE 11.34 Keeping the highest‐speed components away from offboard connect...

FIGURE 11.35 Illustration of the effect of negating the filtering of a signa...

FIGURE 11.36 Illustration of the unintentional coupling of signals between c...

FIGURE 11.37 Creation of a quiet ground where connectors enter a PCB. This a...

FIGURE 11.38 A good PCB layout for a typical digital system.

FIGURE 11.39 The important ground grid: (a) providing many alternate paths a...

FIGURE 11.40 (a) Power distribution circuits require low‐inductance and high...

FIGURE 11.41 Loop areas formed when gates switch state: (a) high‐to‐low; (b)...

FIGURE 11.42 Use of decoupling capacitors to minimize loop areas when gates ...

FIGURE 11.43 Decoupling capacitor placement: (a) use of the ground grid to m...

FIGURE 11.44 Distributed (parallel‐plate) decoupling capacitors reduce the e...

FIGURE 11.45 Effect of component lead inductance: (a) the model; (b) illustr...

FIGURE 11.46 Use of two parallel capacitors in an attempt to eliminate the e...

FIGURE 11.47 Frequency response of the impedance of two decoupling capacitor...

FIGURE 11.48 Transient discharge response of a decoupling capacitor.

FIGURE 11.49 The important consideration of loop area in minimizing radiated...

FIGURE 11.50 Large loop areas of the signal–return path should be minimized ...

FIGURE 11.51 Partitioning analog and digital ground planes, (a) which can cr...

FIGURE 11.52 Effect of power supply filter placement on product emissions: (...

FIGURE 11.53 Illustration that multiple PCBs tend to promote common‐mode cur...

FIGURE 11.54 Illustration of the charging of a conductor by induction: (a) c...

FIGURE 11.55 ESD waveforms: (a) a simple model of human body discharge; (b) ...

FIGURE 11.56 Illustration of multiple ESD discharge paths.

FIGURE 11.57 Methods of reducing secondary arcing: (a) circuit insulation by...

FIGURE 11.58 Use of shielded cables to exclude ESD coupling: (a) circumferen...

FIGURE 11.59 Use of a common‐mode choke to prevent coupling of common‐mode E...

FIGURE 11.60 Use of capacitors to divert ESD discharges: (a) proper capacito...

FIGURE 11.61 Use of diodes to clamp ESD‐induced voltages to safe levels: (a)...

FIGURE 11.62 Illustration of the importance of a local ground where peripher...

FIGURE 11.63 Illustration of the effect of PCB orientation on its susceptibi...

FIGURE 11.64 Diagnostic tools: (a) an electric field probe; (b) a magnetic f...

FIGURE 11.65 Illustration of the concept of dominant effect in conducted emi...

FIGURE 11.66 Illustration that the radiated emissions are due to a combinati...

FIGURE 11.67 In order to reduce the total radiated emission, the dominant co...

FIGURE 11.68 Different methods affect different components: (a) shunt capaci...

FIGURE 11.69 In crosstalk problems, there are two contributions: inductive c...

FIGURE 11.70 The dominant crosstalk contribution depends on the circuit term...

FIGURE 11.71 Shields “grounded” at only one end eliminate capacitive crossta...

Appendix A

FIGURE A.1 (a) The phasor analysis of linear circuits involves determination...

FIGURE A.2 The transformation between the time‐domain circuit and the freque...

FIGURE A.3 Example A.2 ; (a) non‐transformed circuit; (b) transformed circu...

FIGURE EA.2 Review Exercise A.2.

FIGURE PA.1

FIGURE PA.2

FIGURE PA.3

FIGURE PA.4

FIGURE PA.5

FIGURE PA.6

FIGURE PA.7

FIGURE PA.8

FIGURE PA.9

FIGURE PA.10

Appendix B

FIGURE B.1 The rectangular coordinate system: locating a point as the inters...

FIGURE B.2 Differential surfaces and volumes.

FIGURE B.3 Illustration of (a) the dot product and (b) the cross product.

FIGURE B.4 Illustration of the line integral.

FIGURE B.5 Illustration of the surface integral in the determination of flux...

FIGURE B.6 Illustration of Faraday's law.

FIGURE B.7 Illustration of Faraday's law giving the relation between the ind...

FIGURE B.8 Illustration for the open‐circuit voltage induced at the terminal...

FIGURE B.9 Example B.5 : (a) physical dimensions of the circuit; (b) replac...

FIGURE B.10 Example B.6 : (a) first position of the voltmeter leads; (b) sec...

FIGURE EB.5 Review Exercise B.5.

FIGURE EB.6 Review Exercise B.6.

FIGURE B.11 Illustration of inductance (self and mutual); (a) two adjacent c...

FIGURE B.12 Illustration of Ampere's law.

FIGURE B.13 Illustration of Ampere's law and conduction current and displace...

FIGURE B.14 Illustration of capacitance (self and mutual); (a) two objects a...

FIGURE B.15 Illustration of Gauss' law for the electric field. The net flux ...

FIGURE B.16 Illustration of Gauss' law for the magnetic field. The net flux ...

FIGURE B.17 Illustration of the boundary conditions at an interface between ...

FIGURE B.18 Illustration of the boundary conditions where one medium is a pe...

FIGURE B.19 Example B.10 .

FIGURE B.20 Illustration of a uniform plane wave.

FIGURE B.21 Illustration of a wave distributed in space for a fixed time.

FIGURE B.22 Illustration of the electric and magnetic field vectors in a uni...

FIGURE B.23 Spatial properties of a uniform plane wave in a lossy medium: (a...

FIGURE B.24 Illustration of skin depth in a conductor.

FIGURE B.25 The electric and magnetic fields for the TEM mode of propagation...

FIGURE PB.2.1

FIGURE PB.2.2

FIGURE PB.2.3

FIGURE PB.2.4

FIGURE PB.2.5

FIGURE PB.2.7

FIGURE PB.2.8

FIGURE PB.2.9

FIGURE PB.3.1

Appendix C

FIGURE C.1 Cross‐sectional configurations of wire lines for the WIDESEP.FOR ...

FIGURE C.2 Cross‐sectional definition of the ribbon cable parameters for the...

FIGURE C.3 Illustration of the numbering scheme for determining the transmis...

FIGURE C.4 Cross‐sectional definition of the printed circuit board parameter...

FIGURE C.5 Illustration of the numbering scheme for determining the transmis...

FIGURE C.6 Cross‐sectional definition of the coupled microstrip line paramet...

FIGURE C.7 Cross‐sectional definition of the coupled stripline parameters fo...

Appendix D

FIGURE D.1 Node voltage and element voltage notation in the SPICE (PSPICE) c...

FIGURE D.2 Coding convention for (a) the independent voltage source, (b) the...

FIGURE D.3 Coding convention for (a) the voltage‐controlled, current source;...

FIGURE D.4 Coding convention for mutual inductance between two coupled induc...

FIGURE D.5 Coding convention for the two‐conductor, lossless transmission li...

FIGURE D.6 Coding convention for the important source waveforms: (a) the pie...

FIGURE D.7 Example D.1 .

FIGURE D.8 Example D.2 : (a) the circuit to be modeled with nodes identified...

FIGURE D.9 Example D.3 : (a) the circuit to be modeled; (b) the circuit imme...

FIGURE D.10 Starting to lay out the schematic.

FIGURE D.11 Resistor definition screen.

FIGURE D.12 Screen for assigning the value of H1.

FIGURE D.13 Net name screen.

FIGURE D.14 Fully annotated circuit.

FIGURE D.15 Edit simulation command screen.

FIGURE D.16 Results of DC operating point simulation.

FIGURE D.17 Circuit from Figure D.8a configured in LTSPICE.

FIGURE D.18 Simulation parameters for the circuit in Figure D.8a.

FIGURE D.19 Plot of VOUT for circuit D.8a.

FIGURE D.20 LTSPICE configured circuit from Figure D.9c.

FIGURE D.21 Transient simulation screen implementing initial conditions.

FIGURE D.22 Lumped equivalent circuits for computing crosstalk in a three‐co...

FIGURE D.23 Predicted crosstalk for the ribbon cable of Fig. using the tran...

FIGURE D.24 Predicted crosstalk for the printed circuit board of Fig. using...

FIGURE D.25 An equivalent circuit for coupled, lossless transmission lines s...

FIGURE D.26 The complete SPICE model for a three‐conductor line.

FIGURE D.27 Node numbering for the SPICE subcircuit model for connection of ...

FIGURE D.28 An experiment consisting of two wires above a ground plane to il...

FIGURE D.29 Time‐domain near‐end crosstalk for the configuration of Fig. D.2...

FIGURE D.30 Frequency‐domain predictions of the near‐end crosstalk transfer ...

FIGURE D.31 An experiment consisting of three lands on a PCB to illustrate t...

FIGURE D.32 Time‐domain near‐end crosstalk for the configuration of Fig. D.3...

FIGURE D.33 Frequency‐domain predictions of the near‐end crosstalk transfer ...

FIGURE D.34 Example D.7 PSPICE coding.

FIGURE D.35 Example D.8 PSPICE coding.

FIGURE D.36 Example D.9 PSPICE coding.

FIGURE D.37 Example D.10 : (a) the PSPICE coding; (b) the PSPICE simulation ...

FIGURE D.38 Terminal node numbering scheme for the SPICE subcircuit model ge...

FIGURE PD.6.1

FIGURE PD.7.1

Guide

Cover

Table of Contents

Title Page

Copyright

Preface

Begin Reading

Appendix A: The Phasor Solution Method

Appendix B: The Electromagnetic Field Equations and Waves

Appendix C: Computer Codes for Calculating the Per‐Unit‐Length (PUL) Parameters and Crosstalk of Multiconductor Transmission Lines

Appendix D: A SPICE (PSPICE, LTSPICE, etc.) Tutorial and Applications Guide

Appendix E: A Brief History of Electromagnetic Compatibility

Index

End User License Agreement

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834

Introduction to Electromagnetic Compatibility

Third Edition

CLAYTON R. PAULROBERT C. SCULLYMARK A. STEFFKA

This edition first published 2023© 2023 John Wiley and Sons, Inc.

Edition history:2e: 2006, Wiley; 1e: 1992, Wiley

All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording or otherwise, except as permitted by law. Advice on how to obtain permission to reuse material from this title is available at http://www.wiley.com/go/permissions.

The right of Clayton R. Paul, Robert C. Scully, and Mark A. Steffka to be identified as the authors of the editorial material in this work has been asserted in accordance with law.

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Hardback ISBN: 9781119404347

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Preface

Nearly, 30 years have passed since our esteemed colleague, mentor, and friend, Dr. Clayton R. Paul first published his textbook Introduction to Electromagnetic Compatibility. One of, if not the, most thorough and highest quality texts of its kind, Dr. Paul's book has become in that nearly 30‐year time frame one of the world's most well‐known and most widely referenced works on EMC ever written.

Dr. Paul's work has more than survived the “test of time.” The foundation he established has enabled two generations (and counting!) of researchers, engineers, and technicians, to not only successfully master the fundamentals of the EMC discipline but to confront the seemingly ever‐increasing number of EMC requirements levied against all sorts of systems and products, from the largest power generation and distribution systems to the highly integrated and advanced technologies found in the billions of handheld devices in daily use around the world.

Given the stature and ageless character of Dr. Paul's work, with a strong and abiding sense of humility, it is our great honor and privilege to present this third edition of Dr. Paul's outstanding textbook Introduction to Electromagnetic Compatibility.