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This book presents and discusses alternatives to ordinary transmission lines for the design and implementation of advanced RF/microwave components in planar technology.
This book is devoted to the analysis, study and applications of artificial transmission lines mostly implemented by means of a host line conveniently modified (e.g., with modulation of transverse dimensions, with etched patterns in the metallic layers, etc.) or with reactive loading, in order to achieve novel device functionalities, superior performance, and/or reduced size.
The author begins with an introductory chapter dedicated to the fundamentals of planar transmission lines. Chapter 2 is focused on artificial transmission lines based on periodic structures (including non-uniform transmission lines and reactively-loaded lines), and provides a comprehensive analysis of the coupled mode theory. Chapters 3 and 4 are dedicated to artificial transmission lines inspired by metamaterials, or based on metamaterial concepts. These chapters include the main practical implementations of such lines and their circuit models, and a wide overview of their RF/microwave applications (including passive and active circuits and antennas). Chapter 5 focuses on reconfigurable devices based on tunable artificial lines, and on non-linear transmission lines. The chapter also introduces several materials and components to achieve tuning, including diode varactors, RF-MEMS, ferroelectrics, and liquid crystals. Finally, Chapter 6 covers other advanced transmission lines and wave guiding structures, such as electroinductive-/magnetoinductive-wave lines, common-mode suppressed balanced lines, lattice-network artificial lines, and substrate integrated waveguides.
Artificial Transmission Lines for RF and Microwave Applications provides an in-depth analysis and discussion of artificial transmission lines, including design guidelines that can be useful to researchers, engineers and students.
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Seitenzahl: 916
Veröffentlichungsjahr: 2015
Cover
Title page
PREFACE
ACKNOWLEDGMENTS
1 FUNDAMENTALS OF PLANAR TRANSMISSION LINES
1.1 PLANAR TRANSMISSION LINES, DISTRIBUTED CIRCUITS, AND ARTIFICIAL TRANSMISSION LINES
1.2 DISTRIBUTED CIRCUIT ANALYSIS AND MAIN TRANSMISSION LINE PARAMETERS
1.3 LOADED (TERMINATED) TRANSMISSION LINES
1.4 LOSSY TRANSMISSION LINES
1.5 COMPARATIVE ANALYSIS OF PLANAR TRANSMISSION LINES
1.6 SOME ILLUSTRATIVE APPLICATIONS OF PLANAR TRANSMISSION LINES
REFERENCES
2 ARTIFICIAL TRANSMISSION LINES BASED ON PERIODIC STRUCTURES
2.1 INTRODUCTION AND SCOPE
2.2 FLOQUET ANALYSIS OF PERIODIC STRUCTURES
2.3 THE TRANSFER MATRIX METHOD
2.4 COUPLED MODE THEORY
2.5 APPLICATIONS
REFERENCES
3 METAMATERIAL TRANSMISSION LINES: FUNDAMENTALS, THEORY, CIRCUIT MODELS, AND MAIN IMPLEMENTATIONS
3.1 INTRODUCTION, TERMINOLOGY, AND SCOPE
3.2 EFFECTIVE MEDIUM METAMATERIALS
3.3 ELECTRICALLY SMALL RESONATORS FOR METAMATERIALS AND MICROWAVE CIRCUIT DESIGN
3.4 CANONICAL MODELS OF METAMATERIAL TRANSMISSION LINES
3.5 IMPLEMENTATION OF METAMATERIAL TRANSMISSION LINES AND LUMPED-ELEMENT EQUIVALENT CIRCUIT MODELS
REFERENCES
4 METAMATERIAL TRANSMISSION LINES: RF/MICROWAVE APPLICATIONS
4.1 INTRODUCTION
4.2 APPLICATIONS OF CRLH TRANSMISSION LINES
4.3 TRANSMISSION LINES WITH METAMATERIAL LOADING AND APPLICATIONS
REFERENCES
5 RECONFIGURABLE, TUNABLE, AND NONLINEAR ARTIFICIAL TRANSMISSION LINES
5.1 INTRODUCTION
5.2 MATERIALS, COMPONENTS, AND TECHNOLOGIES TO IMPLEMENT TUNABLE DEVICES
5.3 TUNABLE AND RECONFIGURABLE METAMATERIAL TRANSMISSION LINES AND APPLICATIONS
5.4 NONLINEAR TRANSMISSION LINES (NLTLS)
REFERENCES
6 OTHER ADVANCED TRANSMISSION LINES
6.1 INTRODUCTION
6.2 MAGNETOINDUCTIVE-WAVE AND ELECTROINDUCTIVE-WAVE DELAY LINES
6.3 BALANCED TRANSMISSION LINES WITH COMMON-MODE SUPPRESSION
6.4 WIDEBAND ARTIFICIAL TRANSMISSION LINES
6.5 SUBSTRATE-INTEGRATED WAVEGUIDES AND THEIR APPLICATION TO METAMATERIAL TRANSMISSION LINES
REFERENCES
Appendix A EQUIVALENCE BETWEEN PLANE WAVE PROPAGATION IN SOURCE-FREE, LINEAR, ISOTROPIC, AND HOMOGENEOUS MEDIA; TEM WAVE PROPAGATION IN TRANSMISSION LINES; AND WAVE PROPAGATION IN TRANSMISSION LINES DESCRIBED BY ITS DISTRIBUTED CIRCUIT MODEL
Appendix B THE SMITH CHART
Appendix C THE SCATTERING MATRIX
REFERENCE
Appendix D CURRENT DENSITY DISTRIBUTION IN A CONDUCTOR
Appendix E DERIVATION OF THE SIMPLIFIED COUPLED MODE EQUATIONS AND COUPLING COEFFICIENT FROM THE DISTRIBUTED CIRCUIT MODEL OF A TRANSMISSION LINE
Appendix F AVERAGING THE EFFECTIVE DIELECTRIC CONSTANT IN EBG-BASED TRANSMISSION LINES
Appendix G PARAMETER EXTRACTION
G.1 PARAMETER EXTRACTION IN CSRR-LOADED LINES
G.2 PARAMETER EXTRACTION IN SRR-LOADED LINES
G.3 PARAMETER EXTRACTION IN OSRR-LOADED LINES
G.4 PARAMETER EXTRACTION IN OCSRR-LOADED LINES
REFERENCES
Appendix H SYNTHESIS OF RESONANT-TYPE METAMATERIAL TRANSMISSION LINES BY MEANS OF AGGRESSIVE SPACE MAPPING
H.1 GENERAL FORMULATION OF ASM
H.2 DETERMINATION OF THE CONVERGENCE REGION IN THE COARSE MODEL SPACE
H.3 DETERMINATION OF THE INITIAL LAYOUT
H.4 THE CORE ASM ALGORITHM
H.5 ILLUSTRATIVE EXAMPLES AND CONVERGENCE SPEED
REFERENCES
Appendix I CONDITIONS TO OBTAIN ALL-PASS X-TYPE AND BRIDGED-T NETWORKS
ACRONYMS
INDEX
WILEY SERIES IN MICROWAVE AND OPTICAL ENGINEERING
END USER LICENSE AGREEMENT
Chapter 03
Table 3.1 Extracted element parameters for the structures of Figure 3.33
Table 3.2 Parameters for the circuit shown in Figure 3.35a, obtained from Table 3.1
Table 3.3 Extracted element parameters for the structures of Figure 3.39
Chapter 04
Table 4.1 Bandwidth characteristics in the conventional and artificial rat-race couplers
Table 4.2 Element values of the equivalent circuit model for the filter of Figure 4.30
Table 4.3 Comparison of split-ring elliptic lowpass filters
Chapter 06
Table 6.1 Extracted parameters and maximum fractional bandwidth inferred from the circuit model
Table 6.2 Measured eye parameters
Appendix H
Table H.1 Optimal coarse solution
Table H.2 Dimensions of final layouts
Chapter 01
Figure 1.1 Perspective three-dimensional view of a coaxial transmission line. The relevant geometry parameters of the line are indicated, and
ε
r
is the relative permittivity (or dielectric constant) of the dielectric material.
Figure 1.2 Perspective three-dimensional view of the indicated planar transmission lines, and relevant geometry parameters. These transmission lines are used for the implementation of distributed circuits, where the shape and transverse dimensions (
W
,
S
,
G
) of the line (or set of lines and stubs) are determined in order to obtain the required line functionality.
Figure 1.3 Lumped element equivalent circuit model (unit cell) of an ordinary transmission line.
Figure 1.4 Transmission line terminated with an arbitrary load, located at
z
= 0.
Figure 1.5 Transmission line of length
l
fed by a voltage source and terminated with an arbitrary load, located at
z
= 0.
Figure 1.6 Cascade connection of two transmission lines with different characteristic impedance.
Figure 1.7 Bounce diagram corresponding to the example discussed in the text. The vertical axis is the time axis.
Figure 1.8 Parallel plate transmission line with magnetic walls at the edges.
Figure 1.9 Microstrip ring resonator configuration used to extract the dielectric constant and loss tangent of the substrate (a), and typical frequency response with transmission peaks (b).
Figure 1.10 Cylindrical conductor with conductivity
σ
. The effective cross section for the calculation of the AC resistance is given by the annular gray region corresponding to one skin depth.
Figure 1.11 Schematic of two-port transmission lines. (a) Two-conductor unbalanced line, (b) two-conductor balanced line, and (c) three-conductor balanced line.
Figure 1.12 Order-9 Butterworth stepped impedance low-pass filter (a) and measured (solid line) and EM simulated (thin line) frequency response (b). The filter was fabricated on the
Rogers RO3010
substrate with dielectric constant
ε
r
= 10.2, and thickness
h
= 1.27 mm. Filter length is 9.4 cm.
Figure 1.13 Topology of the SISS in microstrip technology and relevant dimensions (
Z
2
≫
Z
1
).
Figure 1.14 SISS-loaded microstrip line (a), insertion and return loss (b) and phase response (c).
Figure 1.15 Topology of a SIR (a), and folded SIR (b).
Figure 1.16 (a) Low-pass elliptic-function prototype filter with shunt connected series resonators (the circuit correspond to a fifth-order prototype), (b) topology of the SIR-based low-pass filter (order-3), (c) equivalent circuit model including parasitics, and (d) EM response, ideal filter prototype response and circuit response including parasitics. The considered substrate thickness and dielectric constant are
h
= 254 μm and
ε
r
= 11.2, respectively. Dimensions are
W
= 5 mm,
G
= 0.55 mm,
a
= 3.24 mm,
b
= 3.99 mm. Back side metal is indicated in black colour. The element values of the ideal prototype filter shown in (a) are
L
1
L
3
= 4.7 nH,
L
2
= 1.38 nH,
C
2
= 2.98 pF. The element values of the complete circuit model in reference to the circuit shown in (c) are
L
1
L
3
= 4.7 nH,
L
2
= 1.65 nH,
C
2
= 2.5 pF,
C
a
= 0.08 pF,
C
b
= 0.44 pF,
C
s
= 0.115 pF. With regard to parasitics,
C
s
models the capacitance associated to the meander, and
C
a
,
C
b
are the capacitances from the central strip to the ground plane.
Figure 1.17 Kuroda identity used for the design of the filter of Figure 1.18.
Figure 1.18 Schematic (a), layout (b), and frequency response (c) of the low-pass filter based on Richard’s transformations. The relevant dimensions (in mm) are indicated. The circuit simulation in (c) was obtained by using a commercial circuit and schematic solver, where the transmission lines and stubs are modeled by the corresponding distributed models.
Figure 1.19 Canonical forms of the two-output distributed symmetric power splitter. (a) With two inverters and (b) with one inverter.
Figure 1.20 Example (layout) of a power splitter (a), and frequency response (b). Relevant dimensions (in mm) and device ports are indicated. The width of the three
λ
/4 lines gives a characteristic impedance of
. The considered substrate is the
Rogers RO3010
with dielectric constant
ε
r
= 10.2 and thickness
h
= 1.27 mm.
Figure 1.21 Example of a capacitively coupled
λ
/2 resonator bandpass filter (a) and frequency response (b). Relevant dimensions (in mm) are indicated. The considered substrate is the
Rogers RO3010
with dielectric constant
ε
r
= 10.2 and thickness
h
= 1.27 mm.
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