Electromechanical Coupling Theory, Methodology and Applications for High-Performance Microwave Equipment E-Book

Baoyan Duan

• Herausgeber: John Wiley & Sons
• Kategorie: Wissenschaft und neue Technologien
• Serie: Wiley - IEEE
• Sprache: Englisch

Seitenzahl: 405

Veröffentlichungsjahr: 2022

Beschreibung

Electromechanical Coupling Theory, Methodology and Applications for High-Performance Microwave Equipment Electromechanical Coupling Theory, Methodology, and Applications for High-Performance Microwave Equipment is an authoritative and up-to-date guide to the structural, mechanical, and electrical aspects of electromechanical coupling. Addressing control, electromagnetism, and structural engineering, this comprehensive reference covers the electromechanical coupling of high-performance microwave electronic equipment (MEE), such as antennas, radar, large radio telescopes, and telecommunication and navigation equipment. The book is divided into four main sections, beginning with an introduction to electromechanical coupling (EMC) theory and a detailed description of the multi-field coupling model (MFCM) and the influence mechanism (IM) of nonlinear factors of antenna-servo-feeder systems on performance. Subsequent sections discuss MFCM- and IM-based design methodology, EMC-based measurement and testing, computer software for coupling analysis and design of electronic equipment, and various engineering applications of EMC theory and the IM of typical electronic equipment. In addition, the book: * Discusses information and data transfer in electromagnetic fields, mechanical and structural deformation fields, and temperature fields * Explains how high-performance microwave electronic equipment differs from traditional mechanical equipment * Addresses EMC-based and general design-vector based optimization of electronic equipment design * Describes applications such as a gun-guided radar system for warships and a large-diameter antenna for moon exploration * Includes evaluation criteria to validate MFCM/IM design theory and methodology Electromechanical Coupling Theory, Methodology, and Applications for High-Performance Microwave Equipment is essential reading for circuit designers, microwave engineers, researchers working with high-frequency microwave engineering, and engineers working with integrated circuits in radar, communications, IoT, antenna engineering, and remote sensing.

Leseprobe

Table of Contents

Cover

Title Page

Copyright

About the Authors

Preface

1 Background of Electromechanical Coupling of Electronic Equipment

1.1 Introduction

1.2 Characteristics of Electronic Equipment

1.3 Components of Electronic Equipment

1.4 On research of Electromechanical Coupling (EMC) of Electronic Equipment

1.5 Problem of the Traditional Design Method of Electronic Equipment

1.6 Main Science and Technology Respects of Design for Electronic Equipment

1.7 Mechatronics Marching Toward Coupling Between Mechanical and Electronic Technologies

References

2 Fundamental of Establishing Multifield Coupling Theoretical Model of Electronic Equipment

2.1 Introduction

2.2 Mathematical Description of Electromagnetic (EM), Structural Deformation (

S

), and Temperature (

T

) Fields

2.3 Consideration of Establishing Multifield Coupling Model

References

3 Multifield Coupling Models of Four Kinds of Typical Electronic Equipment

3.1 Introduction

3.2 Reflector Antennas

3.3 Planar Slotted Waveguide Array Antennas

3.4 Active Phased Array Antennas

3.5 High‐density Cabinets

References

4 Solving Strategy and Method of the Multifield Coupling Problem of Electronic Equipment

4.1 Introduction

4.2 Solving Strategy of the Multifield Coupling Problem

4.3 Solving Method of the Multifield Coupling Problem

4.4 General Approach Method of the Multifield Coupling Problem

4.5 The Mesh Matching Among Different Fields

4.6 Mesh Transformation and Information Transfer

References

5 Influence Mechanism (IM) of Nonlinear Factors of Antenna‐Servo‐Feeder Systems on Performance

5.1 Introduction

5.2 Data Mining of ISFP

5.3 ISFP of Reflector Antennas

5.4 ISFP of Planar Slotted Waveguide Array Antennas

5.5 ISFP of Microwave Feeder and Filters

5.6 ISFP of Radar‐Servo Mechanism

5.7 ISFP of Active Phased Array Antennas with Radiating Arrays

References

6 EMC‐Based Measure and Test of Typical Electronic Equipment

6.1 Introduction

6.2 EMC‐Based Analysis of Measure and Test Factors

6.3 EMC‐Based Measure and Test Technology for Typical Case

6.4 EMC‐Based Measure and Test System for Typical Case

References

7 Evaluation on EMC of Typical Electronic Equipment

7.1 Introduction

7.2 On Correctness of EMC Theory and IM

7.3 On Validation of EMC Theory and IM

7.4 Evaluation of EMC Theory and IM for PSAA

7.5 Evaluation of EMC Theory and IM for a Radar Servo Mechanism

7.6 Evaluation of EMC Theory and IM for Filter

References

8 EMC‐ and IM‐based Optimum Design of Electronic Equipment

8.1 Introduction

8.2 EMC‐ and IM‐based Reflector Optimum Design

8.3 EMC‐ and IM‐based Cabinet Optimum Design

8.4 EMC‐ and IM‐based Radar Servo Mechanism Optimum Design

8.5 A General Design‐vector‐based Optimum Design of Electronic Equipment

References

9 Computer Software Platform for Coupling Analysis and Design of Electronic Equipment

9.1 Introduction

9.2 General Method and System Project

9.3 Integration of the Professional Software

9.4 Software Development of EM‐S‐T Field Coupling Analysis

9.5 Software Development of IM of Structural Factors on Performance

9.6 Software of EMC‐ and IM‐based Measure and Test and Evaluation

References

10 Engineering Applications of EMC Theory and IM of Electronic Equipment

10.1 Introduction

10.2 Application of Moon‐exploration Antenna with the Diameter of 40 m

10.3 Application of the Servomechanism of the Gun‐guided Radar System in Warship

10.4 Application of Planar Slotted Array Antennas

10.5 Application of the Filter with Electrical Adjustable and Double Functioning

10.6 Application of FAST‐500 M Aperture Spherical Radio Telescope

References

11 Development Trends of Electromechanical Coupling Theory and Method of Electronic Equipment

11.1 Introduction

11.2 Extreme Frequencies

11.3 Extreme Environments

11.4 Extreme Power

References

Index

End User License Agreement

List of Tables

Chapter 3

Table 3.1 Analytical and measured results of the 3.7 m diameter reflector a...

Table 3.2 Structural parameters of each waveguide cavity.

Table 3.3 Analysis and experimental results of a planar slotted array anten...

Table 3.4 Basic components of the experimental antenna.

Table 3.5 Analysis and experimental results of an active phased array anten...

Chapter 4

Table 4.1 Solving strategies and methods for CMFP models.

Chapter 5

Table 5.1 45 data samples at 397.5 MHz.

Table 5.2 Measured and predicted data of five sets of filters (397.5 MHz)....

Table 5.3 Comparison of simulated and measured values of antenna electrical...

Table 5.4 Relationship between slot deviation and resonance length (round a...

Table 5.5 The relationship between inclination angle with resonance length ...

Table 5.6 The parameters of the excitation model.

Table 5.7 The research content of the influence mechanism of mechanical str...

Table 5.8 Results of data analysis of filter test samples.

Chapter 6

Table 6.1 Calculation results of the coupling degree of PSAA.

Table 6.2 Existing test means for PSAA.

Table 6.3 Calculation results of azimuthal coupling degree.

Table 6.4 Calculation results of coupling degree of electrically tuned dupl...

Chapter 7

Table 7.1 Field coupling theory and influence mechanism correctness verific...

Table 7.2 Electrical performance‐oriented effectiveness evaluation results....

Table 7.3 Manufacturability‐oriented (cost) evaluation results.

Table 7.4 Effect mechanism correctness verification results.

Table 7.5 Electrical performance‐oriented effectiveness evaluation results....

Table 7.6 Manufacturability‐oriented (cost) evaluation results.

Table 7.7 ESC duplex filter correctness verification results.

Table 7.8 Electrical performance‐oriented effectiveness evaluation results....

Table 7.9 Manufacturability‐oriented evaluation results.

Chapter 8

Table 8.1 Gain loss coefficients of the 7.3 m parabolic reflector antenna....

Table 8.2 Pointing error and gain loss of the 7.3 m parabolic reflector ant...

Table 8.3 Gain loss coefficients of 40 m parabolic reflector antenna.

Table 8.4 Pointing error and gain loss of 40 m parabolic reflector antenna....

Table 8.5 Numerical optimization results of the chassis.

Table 8.6 Comparison of coupling and separation design results of crank‐lin...

Table 8.7 Comparison of the results of the coupled and separated optimizati...

Table 8.8 Optimal design results of the coupled and separated designs of 40...

List of Illustrations

Chapter 1

Figure 1.1 Coupling relationship diagram of each physics field.

Figure 1.2 A 66 m‐S/X‐beam guide antenna for Mars detection.

Figure 1.3 China “Tian Tong No. 1” spaceborne deployable antenna.

Figure 1.4 Early warning airplane – airborne phased array radar.

Figure 1.5 The Yuan Wang ocean survey ship and antenna.

Figure 1.6 Diagram of the traditional electromechanical separation design of...

Figure 1.7 The influence of reflector antenna structure on electrical perfor...

Figure 1.8 FAST 500 m largest radio telescope. (a) Bird's view of the FAST t...

Chapter 2

Figure 2.1 Electromechanical–thermal field coupling diagram.

Figure 2.2 Geometric model of fluid–structure interaction.

Figure 2.3 Numerical analysis flow of each physical field.

Chapter 3

Figure 3.1 Geometric relation of centered reflector antenna.

Figure 3.2 Reflector surface error diagram.

Figure 3.3 The feed error. (a) Feed position error. (b) Feed pointing error....

Figure 3.4 Dual reflector antenna.

Figure 3.5 A C/Ku‐band 3.7 m aperture reflector antenna.

Figure 3.6 Schematic diagram of the load application position.

Figure 3.7 Planar slotted array antennas. (a) Physical view in service. (b)...

Figure 3.8 Geometric relationship of the planar slotted array antenna.

Figure 3.9 Geometric relationships after antenna deformation.

Figure 3.10 Structure of a planar slotted array antenna. (a) Front view. (b)...

Figure 3.11 Finite element model and the location of the applied forced disp...

Figure 3.12 The mounting device to force the antenna deformed.

Figure 3.13 Array spatial coordinate relationships of APAA.

Figure 3.14 Active phased array antennas with construction (a), single excit...

Figure 3.15 Geometric diagram of the radiating unit position offset and poin...

Figure 3.16 Equivalent impedance model. (a) Contact structural model. (b) Eq...

Figure 3.17 Equivalent diagram of waveguide inner wall roughness.

Figure 3.18 Effect of different inner wall roughness on the transmission per...

Figure 3.19 Effect of different metal conductivities on the transmission per...

Figure 3.20 Temperature drift curve of

T

/

R

component. (a) Amplitude‐temperat...

Figure 3.21 Electromagnetic environment of elements in the array.

Figure 3.22 Modal decomposition of electromagnetic properties of array eleme...

Figure 3.23 Characteristic modal coupling.

Figure 3.24 Three typical radiation array element forms. (a) Patch antennas....

Figure 3.25 Experimental test platform systems. (a) From the front view, (b)...

Figure 3.26 CAD model of an X‐band active phased array antenna. (a) Overall ...

Figure 3.27 Diagram of the array surface and active subarray modules. (a) Si...

Figure 3.28 Physical view of the mounting and performance test environment f...

Figure 3.29 Physical diagram of testing the electrical performance of the an...

Figure 3.30 The chassis under loads.

Figure 3.31 Surface currents before and after deformation. (a) Undeformed su...

Figure 3.32 Diagram of chassis No. 1.

Figure 3.33 Physical view of chassis No. 1.

Figure 3.34 Physical view of the four opening sizes of the cover plate. (a) ...

Figure 3.35 Diagram of chassis No. 2.

Figure 3.36 Physical view of chassis No. 2.

Figure 3.37 Chassis No. 2 with open front panel installed.

Figure 3.38 Model of the chassis with the conductive rubber installed.

Figure 3.39 Block diagram of chassis shielding effectiveness test.

Figure 3.40 Darkroom test site with 5 m.

Figure 3.41 Wideband signal source.

Figure 3.42 Receiving antenna.

Figure 3.43 Test and simulation results of the shielding effectiveness of ch...

Figure 3.44 Conductive rubber shielding effectiveness test and simulation re...

Figure 3.45 Schematic diagram of the internal bracket structure of the chass...

Figure 3.46 Schematic diagram of the heat source of the chassis.

Figure 3.47 Variation of the radiation characteristics of the signal source ...

Figure 3.48 Test and simulation results of chassis leakage field strength at...

Figure 3.49 Chassis leakage field strength test and simulation results at hi...

Chapter 4

Figure 4.1 Analysis flow of fluid–solid coupling problem.

Figure 4.2 Mismatching mesh between physical fields.

Figure 4.3 EM mesh generation directly in the structural triangular element....

Figure 4.4 Mesh mapping between reflective surface structure and EM.

Figure 4.5 General flow of information transformation of structural displace...

Figure 4.6 General flow of information transformation of structural displace...

Figure 4.7 Plate and shell element surface mesh transfer flow.

Figure 4.8 Solid element mesh transfer flow.

Figure 4.9 Solid surface mesh extraction and triangulation.

Figure 4.10 Triangulation mesh processing. (a) A quadrilateral face element,...

Figure 4.11 Chassis mesh conversion: (a) structural model, (b) thermal model...

Chapter 5

Figure 5.1 Two ways to discover the influence mechanism.

Figure 5.2 Flow chart of data mining method for correcting intermediate elec...

Figure 5.3 Flow chart of data acquisition.

Figure 5.4 Auxiliary debugging process of cavity filter.

Figure 5.5 The structure of the waveguide filter and the physical photo of t...

Figure 5.6 Comparison between predicted and measured results of influence me...

Figure 5.7 Adjustment amount of bolt (397.5 MHz).

Figure 5.8 Comparison of electrical properties of detuning filter before and...

Figure 5.9 The relationship between aperture field and far field.

Figure 5.10 Schematic diagram of the aperture plane corresponding to the ref...

Figure 5.11 Schematic diagram of the spatial position of the panel deviation...

Figure 5.12 Schematic diagram of antenna reflector panel distribution.

Figure 5.13 Schematic diagram of electromagnetic grid division.

Figure 5.14 Comparison of simulated and measured values of the far‐field pat...

Figure 5.15 Two‐level relationship model of planar slotted array antenna.

Figure 5.16 The relationship among normalized conductance, susceptance, ampl...

Figure 5.17 The influence of waveguide wall thickness on admittance, suscept...

Figure 5.18 The influence of slot width on admittance, susceptance, amplitud...

Figure 5.19 The curve of influence of inclination angle on resonance length....

Figure 5.20 The curve of influence of inclination angle on normalized resona...

Figure 5.21 Influence of waveguide wall thickness on impedance, resistance, ...

Figure 5.22 Influence of slot width on impedance, resistance, amplitude phas...

Figure 5.23 Excitation slot model.

Figure 5.24 Weighting of the influence factor of the structure parameter of ...

Figure 5.25 Design flow of test sample.

Figure 5.26 The admittance curve of the first slot.

Figure 5.27 Hierarchical relationship model between structural factors and e...

Figure 5.28 Hierarchical relationship of structural factors on the no‐load

Q

Figure 5.29 Influence of the deviation of cavity geometry

b

and

l

on the no‐...

Figure 5.30 The influence of the ratio of inner to outer diameter of the coa...

Figure 5.31 Influence of vibrator height on resonance frequency and no‐load

Figure 5.32 Influence of the center shift of the vibrator on the no‐load

Q

v...

Figure 5.33 Relationship between roughness and equivalent conductivity (mate...

Figure 5.34 Relationship between the roughness of each surface of a typical ...

Figure 5.35 Relationship between the roughness of each surface of a typical ...

Figure 5.36 Influence of coaxial cavity assembly connection quality on no‐lo...

Figure 5.37 The coupling coefficient varies with the length

L

and width

W

of...

Figure 5.38 The coupling coefficient varies with the coupling hole wall thic...

Figure 5.39 Relationship between the position and size of the coupling diaph...

Figure 5.40 Relationship between the depth of the tuning screw and the reson...

Figure 5.41 Influence of coaxial cavity filter tuning screws on the coupling...

Figure 5.42 Analysis of power capacity of filters with different stages. (a)...

Figure 5.43 Simulation results of power capacity with the same number of sta...

Figure 5.44 Photos of some typical samples.

Figure 5.45 Schematic diagram of meshing gear with clearance.

Figure 5.46 Bearing nonlinear model.

Figure 5.47 Schematic diagram of tooth surface meshing.

Figure 5.48 Experimental device of servo system.

Figure 5.49 Servo test bench and its control system.

Figure 5.50 Comparison of the speed response simulation and experiment (freq...

Figure 5.51 Speed response error.

Figure 5.52 Accuracy‐related superposition of multilayered surfaces on funct...

Figure 5.53 Basic support surface characterization.

Chapter 6

Figure 6.1 Coupling degree analysis among the test factors and the correspon...

Figure 6.2 DEA decision element.

Figure 6.3 Calculation system of coupling degree for PSAA.

Figure 6.4 Block diagram of machine vision measurement principle.

Figure 6.5 High‐speed photogrammetry.

Figure 6.6 Acceleration sensor measurement.

Figure 6.7 Planar near‐field test system.

Figure 6.8 Schematic diagram of three‐dimensional antenna base structure.

Figure 6.9 Three‐dimensional antenna base orientation drive chain coupling d...

Figure 6.10 Three‐dimensional antenna base orthogonality test site.

Figure 6.11 Three‐dimensional antenna mount split bearing axial clearance te...

Figure 6.12 Block diagram of low‐temperature drive chain friction torque tes...

Figure 6.13 Block diagram of 3D antenna mount servo performance test.

Figure 6.14 Schematic diagram of ESC duplex filter structure.

Figure 6.15 The electrically tuned duplex filter coupling calculation system...

Figure 6.16 Heavy‐duty tool microscope measuring straight.

Figure 6.17 CMM measurement of internal cavity dimensions.

Figure 6.18 Planar slotted array antenna‐integrated test platform.

Figure 6.19 Three‐dimensional antenna base‐integrated test platform.

Figure 6.20 Electrically tuned duplex filter‐integrated test platform.

Chapter 7

Figure 7.1 Affiliation function curve.

Figure 7.2 Distribution of affiliation functions for the two comparison samp...

Figure 7.3 Single electrical performance scoring curve.

Figure 7.4 Flowchart of the calculation of the coincidence degree.

Figure 7.5 Electricity‐oriented performance evaluation process.

Figure 7.6 Electrical performance‐based scoring curve. (a) Biased large type...

Chapter 8

Figure 8.1 7.3 m shipboard reflector antenna.

Figure 8.2 40 m parabolic reflector antenna.

Figure 8.3 Schematic diagram of the internal components of the chassis for t...

Figure 8.4 Chassis structure diagram.

Figure 8.5 The optimized structure.

Figure 8.6 Structural optimization design of radar antenna servo system.

Figure 8.7 Optimal control gain design of the radar antenna servo system.

Figure 8.8 Optimal design of the integrated structural and control of the ra...

Figure 8.9 A crank linkage mechanism‐type reflector antenna.

Figure 8.10 Comparison of motion simulation for coupling and separation desi...

Figure 8.11 Comparison of driving torque for coupling and separation designs...

Figure 8.12 A servo lab bench. (a) Model. (b) Prototype.

Figure 8.13 Unit step response diagram of the system.

Figure 8.14 Simulation and experiment of the unit step response (initial des...

Figure 8.15 The azimuthal rotating body structure of 40 m parabolic reflecto...

Figure 8.16 The step response curve of the 40 m antenna base azimuth axis.

Chapter 9

Figure 9.1 Flow chart of EM–structure–temperature coupling analysis.

Figure 9.2 Comprehensive integration of structural analysis software.

Figure 9.3 Comprehensive integration of electromagnetic analysis software.

Figure 9.4 Comprehensive integration of thermal analysis software.

Figure 9.5 The overall framework of the field coupling prototype software.

Figure 9.6 Computer configuration structure of field coupling prototype soft...

Figure 9.7 Interrelationship of software modules in field coupling prototype...

Figure 9.8 Composition of field coupling interaction.

Figure 9.9 Field coupled data exchange interface.

Figure 9.10 The main interface of the software system for field coupling ana...

Figure 9.11 Typical case study module.

Figure 9.12 3D model conversion module.

Figure 9.13 3D model modification module.

Figure 9.14 Reflector antenna field coupling analysis module.

Figure 9.15 Reflector antenna wind load automatic generation module.

Figure 9.16 Reflector antenna heat flow density generation module.

Figure 9.17 Planar slotted array antenna field coupling analysis module.

Figure 9.18 Active phased array antenna field coupling analysis module.

Figure 9.19 Block diagram of the impact mechanism prototype software system....

Figure 9.20 Analysis interface of antenna feeder system.

Figure 9.21 Radar antenna servo topology management.

Figure 9.22 Subaxis definition process.

Figure 9.23 Simulation calculation and extraction.

Figure 9.24 Controller selection and control parameter setting interface.

Figure 9.25 First‐order torsional vibration mode of the system.

Figure 9.26 Unit step response of the system. (a) Step response, (b) Error f...

Figure 9.27 Components of the comprehensive assessment prototype system.

Figure 9.28 Workflow of the comprehensive assessment prototype system.

Figure 9.29 Database architecture of the comprehensive assessment prototype ...

Figure 9.30 Test data interface tree diagram.

Figure 9.31 Test data interface module of planar slotted array antennas.

Figure 9.32 Three‐dimensional antenna base test data interface module.

Figure 9.33 Interface of electrically tuned filter structure parameters.

Figure 9.34 Three‐dimensional antenna base coupling relationship table inter...

Figure 9.35 3D antenna base subjective coupling degree calculation raw data ...

Figure 9.36 The subjective coupling degree calculation interface of 3D anten...

Figure 9.37 Three‐dimensional antenna seat objective coupling degree calcula...

Figure 9.38 3D antenna base subjective/objective comprehensive processing co...

Figure 9.39 3D antenna base correctness check data after import interface.

Figure 9.40 3D antenna base all samples servo correctness check results inte...

Figure 9.41 Sample interface of 3D antenna mount based on electrical perform...

Figure 9.42 Sample interface for evaluating the manufacturability‐based effe...

Figure 9.43 Interface after importing sample data of 3D antenna holders base...

Figure 9.44 Sample data modification interface for 3D antenna holders based ...

Figure 9.45 The evaluation result of 3D antenna based on manufacturability e...

Chapter 10

Figure 10.1 Comparison of old and new 40 m reflector antenna solutions.

Figure 10.2 Physical diagram of the fire control radar structure of a naval ...

Figure 10.3 Comparison of the traditional and new fire control radar structu...

Figure 10.4 Schematic diagram of the antenna array structure. (a) side view,...

Figure 10.5 Physical model of the filter with electrical adjustable and doub...

Figure 10.6 Innovative design of the FAST optomechatronics design. Source: Q...

Figure 10.7 Flexible cable support and coarse‐finish composite adjustment de...

Figure 10.8 Physical photograph of the FAST trilogy of scaled‐down model tes...

Chapter 11

Figure 11.1 The world's largest fully steerable QTT110 m radio telescope.

Figure 11.2 Physical picture of ground demonstration and verification system...

Guide

Cover

Table of Contents

Title Page

Copyright

About the Authors

Preface

Begin Reading

Index

End User License Agreement

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Editor in Chief

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Thomas Robertazzi

Electromechanical Coupling Theory, Methodology and Applications for High‐Performance Microwave Equipment

Baoyan Duan and Shuxin ZhangXidian University, China

Copyright © 2023 by The Institute of Electrical and Electronics Engineers, Inc. All rights reserved.

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Library of Congress Cataloging-in-Publication Data

Names: Duan, Baoyan, author. | Zhang, Shuxin (Professor of electromechanical engineering), author.Title: Electromechanical coupling theory, methodology and applications for high-performance microwave equipment / Baoyan Duan and Shuxin Zhang.Description: Hoboken, New Jersey : Wiley, [2023] | Includes bibliographical references and index.Identifiers: LCCN 2022049658 (print) | LCCN 2022049659 (ebook) | ISBN 9781119904397 (hardback) | ISBN 9781119904403 (adobe pdf) | ISBN 9781119904410 (epub)Subjects: LCSH: Microwave devices. | Microwave circuits. | Couplings.Classification: LCC TK7876 .D83 2023 (print) | LCC TK7876 (ebook) | DDC 621.381/32-dc23/eng/20221103LC record available at https://lccn.loc.gov/2022049658LC ebook record available at https://lccn.loc.gov/2022049659

Cover Design: WileyCover Image: © Solarseven/Shutterstock

About the Authors

Baoyan Duan received the B. Eng., M. Eng., and Ph. D. degrees in Electromechanical Engineering from XDU in 1981, 1984, and 1989, respectively. From 1991 to 1994, he was a Postdoctoral Fellow at Liverpool University, U.K., and worked as Visiting Scientist at Cornell University, Ithaca, NY, in 2000. He is currently Academician of Chinese Academy of Engineering (CAE) and full Professor in the School of Electromechanical Engineering at XDU where he founded the Research Institute on Mechatronics. He was engaged as President of Xidian University (XDU), Xi'an, China, from 2002 to 2012.

Baoyan Duan has been dedicating himself to the research of electromechanical engineering and opened new areas of electromechanical coupling (EMC) theory in electromagnetic, structural deformation, and temperature fields of microwave electronic equipment (MEE). He has made known the influence mechanism (IM) of nonlinear mechanical parameters on electronic performance of MEE. He developed the integrated design methodology of MEE based on EMC and IM. The above academic achievements have been successfully applied in national major engineering projects such as the deep space exploration, the Shenzhou spacecraft, the Tiantong No.1‐ space deployable antenna, and so on.

As the Chief Design Engineer, he led the design team and was involved in implementing an innovative design called optomechatronic design with electronic, mechanical, and optic technologies, by which the millimeter dynamic‐accuracy‐positioning and ultra‐light‐weight (from 8,000 tons to 30 tons) were implemented for 500m diameter spherical radio telescope (FAST500m). The telescope has been in operation since 2016 and many new planets have been observed for the first time. He was invited to provide a keynote speech on this achievement at EuCAP'2018 in London.

Baoyan Duan serves as the Chair of Antenna Industry Alliance (AIA) of China and Chair of Electromechanical Engineering Society of China. He is a Fellow of International Engineering and Technology (IET) and Chinese Institute of Electronics (CIE), Members of Int. Society for Structural and Multidisciplinary Optimization (SMO). He is engaged as the editor‐in‐chief of Electromechanical Engineering of China, the editor‐in‐deputy chief of Chinese Journal of Electronics, the Section editor‐in‐chief of CAE flagship magazine ENGINEERING, and the editor of 10 more academic journals.

Baoyan Duan has published 200 papers and six books and authorized 40 patents of invention. He has received, as the first author, the 1st prize of national award for science and technology progress (STP) of China 2020, and the 2nd prize of national award for STP of China three times (2004, 2008, and 2013). In 2009, he was selected as science Chinese person. In 2012, he was issued Hong Kong HLHL prize of STP. In 2017, he received the Award for Outstanding Scientific and Technological Achievement from CAS and the Golden Prize of Good Design of China. In 2018, he received the Life Achievement Award from the Asian Society of SMO.

CCTV (China Central TeleVision station) broadcasted a special program DUAN Baoyan: Minor Discipline and Great Vision in 2016.

Shuxin Zhang received the B. Eng. and Ph. D. degrees in mechanical engineering from Xidian University in 2006 and 2015, respectively. He is currently a Professor of Electromechanical Engineering in the Key Laboratory of Electronic Equipment Structure (Ministry of Education) in Xidian University.

Shuxin Zhang's research interests include the areas of integrated structural‐electromagnetic analysis and optimization design of reflector antennas, and structural and multidisciplinary design of deployable antennas.

Shuxin Zhang has published 25 papers and authorized 15 patents of invention. He received the Excellent Doctoral Dissertation Nomination Prize bestowed by the Chinese Institute of Electronics in 2018.

Preface

Complex information and electronic equipment is a system that combines electromagnetism, mechanics, thermodynamics, and other disciplines. The successful realization of its electrical performance depends not only on the design level of various disciplines, but also on the organic combination of multiple disciplines. For example, the mechanical structure is not only is the carrier and guarantee for the realization of electrical performance, but also often restricts the realization of electrical performance. On the other hand, electrical performance also puts forward higher requirements on the mechanical structures. Therefore, mechanism and electrics are interrelated, interdependent, mutually influencing, and inseparable. Especially for complex electronic equipment with high frequency band, high gain, high density, miniaturization, fast response, and high pointing accuracy, the disciplines of mechanics and electrics show the characteristics of strong coupling. We call the mechanical and electrical interaction of electronic equipment the electromechanical coupling problem of electronic equipment.

The traditional mechanical and electrical separation design of complex electronic equipment leads to low performance, long cycle, high cost, and heavy structure in the development of electronic equipment. It has become a development bottleneck that has restricted the performance of electronic equipment in a long period of time and affected the development of equipment in the next generation. The detailed design procedure of the traditional electromechanical separation design is that the electrical designers put forward requirements for the mechanical mechanism design according to the requirements of the electrical performance, and the mission of the structural designers is to try to meet its detailed requirement. Due to the fact that the electrical designers do not have enough understanding of the difficulty of mechanical design and manufacturing, and that they leave enough space for the subsequent electric adjustment at the same time, the required accuracy is often difficult to meet, and sometimes it even exceeds the capability of mechanical manufacturing. On the other hand, due to the lack of understanding and mastery of electromagnetic knowledge for mechanical designers, the only way is to do everything possible to satisfy the accuracy. This traditional design introduces two problems. One is that the structure manufactured in accordance with the accuracy requirements cannot guarantee 100% of the electrical performance, and the other one is that the structure that does not meet the accuracy requirements often meets the electrical performances in contrary. This situation has existed for a long time and has not been fundamentally resolved.

It can be seen that the key to the design of electronic equipment is the study of electromechanical coupling. Specifically, it includes establishing a theoretical model of field coupling between the mechanical displacement field, electromagnetic field, and temperature field, exploring the influence mechanism of mechanical factors on electrical performance, proposing the electromechanical coupling test methods, evaluation methods, and multidisciplinary optimization design methods based on field coupling theory and influence mechanism, and developing a comprehensive design software platform that integrates electromagnetics, mechanics, and thermodynamics to fundamentally solve the long‐standing bottleneck problem that restricts the improvement of electronic equipment performance and affects the development of electronic equipment in the next generation.

Based on this idea, the first author has been engaged in the scientific research and engineering application of electronic mechanical engineering since he was a master's student in the early 1980s, and is committed to the research and application of the interdisciplinary nature of electromechanical coupling technology of electronic equipment. After that, at the beginning of this century, on the basis of the long‐term research work in the past, the national 973 project of “Research on Basic Problems of Electromechanical Coupling of Electronic Equipment” was further put forward and approved. With the joint efforts of a research team formed by technicians from universities, research institutes, and other units, substantial progress has been made in theory and technology, and a comprehensive design software platform has been developed, which has been applied in typical engineering cases and achieved satisfactory results.

The content of this book is a summary of past scientific research work. During the preparation of the manuscript, Congsi Wang, Fei Zheng, Jin Huang, Guangda Chen, Lihao Ping, and Yong Wang provided active help in different ways. Section 4.6 of the book is written by Jin Huang to complete the first manuscript, Chapters 5 and 6 are written by Guangda Chen to complete the first manuscript, and Chapter 8 is written by Congsi Wang to complete the first manuscript. In addition, the work of this book also includes the work of other comrades, such as Peng Li, Liwei Song, Hong Bao, Wei Wang, Shenghuai Zhou, Jinzhu Zhou, Hongbo Ma, Minbo Zhu, Fushun Zhang, Yongchang Jiao, Xiansong Guo, Jundong Shi, Zhijian Yan, Changwu Xiong, and Zhenfang Shen. The authors would like to express heartfelt thanks to them.

The authors also express special thanks to the national 973 project expert team represented by academicians Lvqian Zhang, Guangyi Zhang, and Xixiang Zhang for their effective guidance in the progress of the project.

The first author is deeply grateful to his supervisor, Professor Shanghui Ye. Since 1982, he has studied and worked under the guidance of Professor Ye. He will never forget his mentor's guidance and help in many ways.

Due to the limited level of the authors and the rush of time, it is inevitable that there are some defects and deficiencies of one kind or another in the book. Readers are welcome to criticize and correct them.

This book can be used as a reference book for teachers, postgraduates, and senior undergraduates of colleges and universities, and engineering and technical personnel of research institutes.

1Background of Electromechanical Coupling of Electronic Equipment

1.1 Introduction

Electronic equipment is a kind of special electromechanical equipment that targets the acquisition, transmission, and processing of electromagnetic signals or other electrical performance and adopts mechanical structures as the carrier.

Complex and high‐performance electronic equipment is nothing but a system composed of multiple disciplines such as electronics, mechanical structures, and heat transfer. The successful acquisition of its performance depends not only on the design quality of each simple discipline but also, even more important, on the intersection and inosculation among them. This is because the mechanical structure not only guarantees the electrical performance as the carrier but also often restricts the realization and promotion of electrical performance. Therefore, it is necessary to study the electromechanical coupling of electronic equipment, toward establishing the electromechanical coupling theoretical model, making the influence mechanism of nonlinear structural factors on electromagnetic performance clear, and finally developing electromechanical coupling model and the influence mechanism‐based system design theory and methodology.

Since the First Industrial Revolution, mechanical equipment has become the foundation of industrialization. Since the middle of the twentieth century, the rapid development of both electronic technology and computer technology has gradually made electronic equipment become an important equipment of modern industrial society. It has been widely applied in various fields such as land, sea, air, and space. With the development of science and technology, the demand of complex and high‐performance electronic equipment is becoming more and more urgent.

The development of electronic equipment has passed through the age of electron tubes, the age of transistors, and the current era of integrated circuits. This is classified based on the devices. In terms of working frequency, it has experienced the low‐frequency era, the high‐frequency era, and is moving toward ultrahigh frequency and terahertz (THz) frequency bands. Compared with the early electronic equipment, the prominent features of the modern electronic equipment are high frequency, high gain, large frequency width, high pointing accuracy, high density, and miniaturization, all of which put forward high requirements and greater challenges for the design and manufacturing of mechanical structural parts, some of which even exceed the limits of manufacturing ability. At this time, the electrical part and mechanical structure of the electronic equipment must be considered simultaneously and comprehensively, and the electromechanical coupling design is urgently needed [1, 2]. Unfortunately, the traditional design is independent between mechanical and electronic technologies, which leads to poor performance, long cycle, high cost, and unwieldy. It significantly restricts the improvement of the level of electronic equipment.

The way to solve the problem of electromechanical separation design is the electromechanical coupling design, which includes multifield coupling problem and the influence mechanism of electronic equipment. The research content of multifield coupling problem is to make the relationship between mechanics and electronics clear from the perspective of field coupling, and the task of influence mechanism is to find the influence mechanism of nonlinear structural factors on electrical properties. These two parts complement each other and are two manifestations of electromechanical coupling theory [3, 4].

The in‐depth study of the electromechanical coupling of electronic equipment is the prerequisite for the development of high‐performance electronic equipment. Early researches did not start from the level of electromechanical coupling. This was because the working frequency band was not high or the volume requirements were not harsh at that time. But now it is not the case, because mechanics and electronics are inseparable, and researches must be carried out from the system level of mechanics and electronics or mechanics, electronics, and heat transfer coupling to solve the problem thoroughly. There are two manifestations of electromechanical coupling, one is the form of field coupling, and the other is the influence mechanism. In engineering, the influence mechanism was understood in earlier times, and many researches were carried out. With the development of science and technology, the roles of different physical fields have been gradually recognized, so the electromechanical coupling problem of electronic equipment has begun to be investigated from the perspective of the field.

As for the concerned influence mechanism, the purpose is to understand, discover, and master the influence mechanism of mechanical structural factors on electrical performance and then provide empirical formulas, diagrams, and design specifications for guiding the electromechanical coupling design of electronic equipment. Mechanical structural factors include structural parameters and manufacturing tolerance. The field coupling theory is to provide a mathematical relationship between different physical fields, that is the mathematical model.

Generally speaking, coupled multifield problems (CMFP) refer to a physical phenomenon in which two or more physical fields affect each other through interaction. This phenomenon is widespread in objective world and practical engineering [5]. Common coupling problems include fluid–solid coupling, gas–solid–liquid coupling, structural–electromagnetic–thermal coupling, structural–optical coupling, acoustic–structural coupling, and electrostatic–structural coupling [6–15]. Through the analysis of some coupling phenomena appearing in actual engineering and the study of the inherent physical properties of each physical field itself, the mutual influence relationship between the physical fields can be initially determined (Figure 1.1). The inside of the circle in the figure is a physical field, the directed line segment indicates the interaction between the physical fields, and the text in the line segment indicates the physical quantity acting on it.

As for the CMFP appearing in electronic equipment, the coupling relationship among the physical fields can be simply expressed as follows. Taking the reflector antenna as an example, which is used in telecommunication, navigation, radar, radio telescope, and space deployable antenna, the reflector is used as the boundary of the electromagnetic field. When it is subjected to environmental loads (self‐weight, wind, temperature, vibration, shock, etc.), the antenna reflector surface is deformed, which will change the boundary conditions of the electromagnetic field and affect the realization of electrical performance, such as gain degradation, increase in sidelobe level, and poor beam pointing accuracy. This is the first fact. In reverse, as the working frequency increases (the wavelength decrease), a tiny change in the electronic performance will give rise to a big change in the antenna structure to guarantee this tiny change, which needs a large change to fit the performance. Meanwhile, as the working frequency becomes higher, the relationship between structure and electromagnetic performance becomes tier. From this viewpoint, the influence between antenna electronic and structural parameters is mutual and dual directional.

Figure 1.1 Coupling relationship diagram of each physics field.

Furthermore, as the advent of the space era, the demand on spaceborne deployable antenna is urgent, of which the requirements are large diameter, high precision, light weight, and large ratio of the deployed size to furled size. To meet these requirements, the membrane antennas have been pushed in the research and application. Because of the low stiffness of membrane outside the surface, the electromagnetic pressure on membrane reflector from feed and space cannot be ignored. At this time, the influence between antenna electronic and structural parameters is mutual and dual directional [16].

1.2 Characteristics of Electronic Equipment

Modern electronic equipment have a wide variety of functions and appearances. The most typical electromagnetic signal receiving and transmitting equipment is the antenna. The reflector antenna is one of the most widely used form of antennas, such as the reflector antenna used in lunar and deep space exploration and the deployable antenna on communication satellites, as shown in Figures 1.2 and 1.3. The earliest electromagnetic signal‐processing equipment are radar transmitters, receivers, power amplifiers, and other equipment. Modern electronic technology usually uses the equipment as a functional module and then integrates them into one device, such as avionics, where each functional module is installed in the same chassis, and the lower part is a shared heat dissipation channel.

Figure 1.2 A 66 m‐S/X‐beam guide antenna for Mars detection.

Figure 1.3 China “Tian Tong No. 1” spaceborne deployable antenna.

Modern electronic equipment have more powerful functions and more complex systems far beyond the scope of early electronic equipment. For example, in the Air Police 2000 early warning aircraft, as shown in Figure 1.4, not only the radar system and communication system on the aircraft are electronic equipment but also the entire early warning aircraft itself is an electronic equipment. Similar is the case for Yuan Wang ocean survey ship shown in Figure 1.5; regardless of its volume and size and how much pure is the mechanical equipment on it, considering the fact that the mission of the survey ship is to obtain and process the electromagnetic signals, it can also be called an electronic equipment.

Figure 1.4 Early warning airplane – airborne phased array radar.

Source: Twitter/ST.

Figure 1.5 The Yuan Wang ocean survey ship and antenna.

Source: (a) baike.com.

The most notable feature of the electronic equipment is the integration with electromagnetic and mechanical technologies. Different from general mechanical equipment containing electrical components, the electronic equipment takes electrical performance as the main task of entire equipment, while the mechanical part is being subjected to electrical performance. That is to say, the mechanical part serves as the carrier and guarantees the realization of electrical performance.

Compared with general machines or traditional machines, the characteristics of electronic machines are embodied as follows: In terms of purpose, electronic machine pursues the electrical performance of electronic equipment systems, while conventional machine pursues their mechanical performance. In terms of the realization means, electronic machine is mainly realized by changing and optimizing mechanical structural parameters and processes, while traditional machine is mainly realized by adding electronic technology, optoelectronics, and other technologies.

Electronic equipment are one of the main research objects in the field of electromechanical engineering. Their essence is to study the crossover and integration of different disciplines, with a view to discovering theories, methods, and technical means to improve the performance of systems or equipment by studying the coupling problems between different physical quantities or physical fields. Electromechanical engineering mainly studies the mechanical design, structural design, and manufacturing of electronic equipment, information equipment, or electronic systems. Its characteristic lies in how to make the system or equipment meet the electrical performance requirements in the complex mechanical environment, electromagnetic environment, and thermal environment and retain high reliability.

1.3 Components of Electronic Equipment

1.3.1 Mechanical and Structural Part of Electronic Equipment

The mechanical and structural part of the electronic equipment includes two main aspects. One is the overall layout of the electronic equipment structure according to the working environment, the technical requirements, the overall conception of the system, and the design and planning of the subsystems. The other one is the design of mechanical parameters. For the equipment installed in the movable platform or transportation requirements, there should be sufficient strength and stiffness to resist a variety of environmental loads caused by material fatigue, structural resonance on the effects of electrical performance. If necessary, special vibration isolation and buffering measures have to be used too.

This is the most traditional area of structural design for electronic equipment and one of the earliest developed and most mature aspects of the design theory and methodology.

There are also requirements for electromagnetic compatibility (EMC