Electronic Materials Innovations and Reliability in Advanced Memory Packaging E-Book

Chong Leong, Gan

• Herausgeber: Springer Nature Switzerland
• Kategorie: Wissenschaft und neue Technologien
• Serie: Springer Series in Reliability Engineering
• Sprache: Englisch

Veröffentlichungsjahr: 2025

Beschreibung

This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).

The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.