104,99 €
This book describes a full range of contemporary techniques for the design of transmitters and receivers for communications systems operating in the range from 1 through to 300 GHz. In this frequency range there is a wide range of technologies that need to be employed, with silicon ICs at the core but, compared with other electronics systems, a much greater use of more specialist devices and components for high performance – for example, high Q-factor/low loss and good power efficiency. Many text books do, of course, cover these topics but what makes this book timely is the rapid adoption of millimetre-waves (frequencies from 30 to 300 GHz) for a wide range of consumer applications such as wireless high definition TV, '5G' Gigabit mobile internet systems and automotive radars. It has taken many years to develop low-cost technologies for suitable transmitters and receivers, so previously these frequencies have been employed only in expensive military and space applications. The book will cover these modern technologies, with the follow topics covered; transmitters and receivers, lumped element filters, tranmission lines and S-parameters, RF MEMS, RFICs and MMICs, and many others.
In addition, the book includes extensive line diagrams to illustrate circuit diagrams and block diagrams of systems, including diagrams and photographs showing how circuits are implemented practically. Furthermore, case studies are also included to explain the salient features of a range of important wireless communications systems. The book is accompanied with suitable design examples and exercises based on the Advanced Design System – the industry leading CAD tool for wireless design.
More importantly, the authors have been working with Keysight Technologies on a learning & teaching initiative which is designed to promote access to industry-standard EDA tools such as ADS. Through its University Educational Support Program, Keysight offers students the opportunity to request a student license, backed up with extensive classroom materials and support resources. This culminates with students having the chance to demonstrate their RF/MW design and measurement expertise through the Keysight RF & Microwave Industry-Ready Student Certification Program.
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Seitenzahl: 907
Veröffentlichungsjahr: 2016
Ian Robertson
University of Leeds, UK
Nutapong Somjit
University of Leeds, UK
Mitchai Chongcheawchamnan
Prince of Songkla University, Thailand
This edition first published 2016 © 2016 John Wiley & Sons, Ltd
First Edition published in 2016
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About the Authors
Acknowledgements
Preface
1 Introduction
1.1 A Brief Timeline of Consumer Electronics
1.2 The Electromagnetic Spectrum
1.3 Industry Trends
1.4 Forms of Wireless Communication
1.5 Conclusion
References
2 Transmitters and Receivers
2.1 Introduction
2.2 Transmitter and Receiver Components
2.3 Noise and Interference
2.4 Introduction to Modulation
2.5 Digital Modulation
2.6 Noise Analysis and Link Budget Calculation
2.7 Some Wireless Transceiver Architectures
2.8 Conclusion
References
3 Scattering Parameters
3.1 Introduction
3.2
Z
-Parameters (Open-Circuit Impedance Parameters)
3.3
Y
-Parameters (Short-Circuit Admittance Parameters)
3.4
H
-Parameters (Hybrid Parameters)
3.5
ABCD
-Parameters (Transmission or Chain Parameters)
3.6 Summary of Two-Port Parameter Operations
3.7 Scattering Parameters
3.8 Transmission Parameters
References
4 Lumped-Element Filters
4.1 Introduction
4.2 Filter Theory
4.3 Butterworth, Chebyshev and Elliptic Low-Pass Prototypes
4.4 Filter Design Method
4.5 Practical Lumped Elements
4.6 Capacitively-Coupled Resonator Filter
References
5 Transmission Line Theory
5.1 Introduction
5.2 Reflections on Transmission Lines
5.3 Transmission Line Theory
5.4 Standing Waves on a Lossless Transmission Line with Mismatched Load
5.5 The Smith Chart
5.6 The Signal Flow Graph
5.7 Conclusion
References
6 Transmission Line Components
6.1 Introduction
6.2 Coaxial Components
6.3 Twisted Pairs and Twin-Lead
6.4 Rectangular Waveguide
6.5 Microstrip
6.6 Common Microstrip Components
6.7 Uniplanar Transmission Lines
6.8 Other Transmission Line Types
6.9 Conclusion
References
7 Transmission Line Filters
7.1 Introduction
7.2 Unloaded
Q
of a Transmission Line Resonator
7.3 Lumped-to-Distributed Conversion
7.4 Impedance and Admittance Inverters
7.5 Richards Transformation
7.6 Unit Element, Kuroda's Identity and Coupled-Lines Section
7.7 Stepped-Impedance Low-Pass Filter
7.8 Parallel-Coupled Line Filter
7.9 Interdigital Filter
7.10 Combline Filter
7.11 Hairpin Filter
7.12 Cross-Coupled Filters
7.13 Conclusion
References
8 Semiconductor Devices
8.1 Introduction
8.2 Fabrication Technology
8.3 Field-Effect Transistors
8.4 Bipolar Transistors
8.5 Package Styles
8.6 High-Power Transistors
8.7 RFICs and MMICs
8.8 Two-Terminal Devices
References
9 Impedance Matching
9.1 Introduction
9.2 The Purpose of Impedance Matching
9.3 Lumped-Element Matching Networks
9.4 Distributed Matching Networks
9.5 The Cyclic Nature of Distributed Circuits
9.6 Conclusion
References
10 Amplifiers
10.1 Introduction
10.2 Transistor Configurations
10.3 Classical Analysis of Gain and Stability
10.4 DC Biasing
10.5 Common Amplifier Topologies
10.6 Low-Noise Amplifiers
10.7 Nonlinearity and Intermodulation
10.8 Power Amplifier Classes of Operation
10.9 Power-Combining Techniques
10.10 Power Amplifier Linearisation
10.11 Conclusion
References
11 Oscillators
11.1 Introduction
11.2 Basic Concepts
11.3 Resonators
11.4 Some Oscillator Circuits
11.5 Oscillator Design Procedure
11.6 Conclusion
References
12 Mixers and Modulators
12.1 Introduction
12.2 Single-Ended Mixers
12.3 Balanced and Image-Rejection Mixers
12.4 Baluns and Couplers
12.5 Common Mixer Circuits
12.6 Modulators
12.7 Mixer Linearisation and Adaptive Signal Cancellation
12.8 Conclusion
References
13 RF MEMS
13.1 Introduction
13.2 Novel Transceiver Architectures using RF MEMS
13.3 Micromachined Transmission Lines and Passive Elements
13.4 RF MEMS Switches
13.5 Reconfigurable Impedance-Matching Networks
13.6 MEMS Phase Shifters
13.7 Tuneable Filters
13.8 MEMS Antennas
13.9 RF MEMS Fabrication and Packaging
13.10 Reliability and Design Consideration of RF MEMS Devices
References
14 Antennas and Propagation
14.1 Introduction
14.2 Antenna Systems
14.3 Transmission Equations, Free-Space Path Loss and Link Budget Calculation
14.4 Other Propagation Effects
14.5 Millimetre-Wave and THz Propagation
14.6 Indoor Propagation
14.7 Outdoor Propagation
14.8 Multipath Propagation
14.9 Antenna Arrays
14.10 Multiple-Input and Multiple-Output Systems
References
15 Digital Signal Processing for Transceivers
15.1 Introduction
15.2 RF Performance Challenges
15.3 DSP in Modern Wireless Communications Systems
15.4 Signal Conversion and Processing
15.5 Digital Calibration for
I
–
Q
Imbalance
15.6 Digital Predistortion Techniques
15.7 DSP Techniques for OFDM
15.8 MIMO
15.9 Conclusion
References
16 Packaging and Assembly
16.1 Introduction
16.2 Technology Options and System Partitioning
16.3 PCB/Laminate Technology
16.4 Thin-Film Fabrication
16.5 Thick-Film Fabrication
16.6 LTCC Technology
16.7 Chip Packaging
16.8 Manufacturing using Surface Mount Technology
16.9 System-in-Package and System-on-Substrate Technology
16.10 Transitions and Antenna-in-Package Techniques
16.11 Conclusion
References
17 Electronic Design Automation
17.1 Introduction
17.2 Linear Frequency-Domain Analysis
17.3 Time-Domain Simulation
17.4 Harmonic Balance
17.5 Large-Signal/Small-Signal Simulation
17.6 Planar Electromagnetic Simulation
17.7 3-D Electromagnetic Simulation
17.8 Integrated Circuit Simulation and Layout
17.9 Conclusion
References
18 Measurement Techniques
18.1 Introduction
18.2 The Oscilloscope
18.3 Function Generator and Arbitrary Waveform Generator
18.4 LCR Meters and Component Analysers
18.5 Signal Generators
18.6 Spectrum and Signal Analysers
18.7 Vector Network Analysers
18.8 Microstrip Test Fixture Measurements
18.9 Probe Station Measurements
18.10 Mixed-Mode
S
-Parameters
18.11 Source- and Load-Pull Measurements
18.12
X
-Parameter Measurements
References
Glossary
Index
EULA
Chapter 1
Table 1.1
Table 1.2
Chapter 2
Table 2.1
Table 2.2
Chapter 3
Table 3.1
Chapter 4
Table 4.1
Chapter 6
Table 6.1
Chapter 7
Table 7.1
Chapter 8
Table 8.1
Chapter 11
Table 11.1
Chapter 15
Table 15.1
Chapter 17
Table 17.1
Cover
Table of Contents
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Ian Robertson received his BSc (Eng.) and PhD degrees from King's College London in 1984 and 1990, respectively. From 1984 to 1986 he worked in the GaAs MMIC Research Group at Plessey Research, Caswell. After that he returned to King's College, initially as a Research Assistant working on the T-SAT project and then as a Lecturer, leading the MMIC Research Team and becoming Reader in 1994. In 1998 he was appointed Professor of Microwave Subsystems Engineering at the University of Surrey, where he established the Microwave Systems Research Group and was a founder member of the Advanced Technology Institute. In June 2004 he was appointed to the Centenary Chair in Microwave and Millimetre-Wave Circuits at the University of Leeds. He was Director of Learning and Teaching from 2006 to 2011 and Head of School from 2011 to 2016. He has 30 years of teaching experience in RF and microwave engineering and has published over 400 peer-reviewed research papers. He edited the book MMIC Design published by the IEE in 1995 and co-edited the book RFIC & MMIC Design and Technology, published in English in 2001 and in Chinese in 2007. He was elected Fellow of the IEEE in 2012 in recognition of his contributions to MMIC design techniques and millimetre-wave system-in-package technology. He was General Technical Programme Committee Chair for the European Microwave Week in 2011 and 2016.
Nutapong Somjit received the Dipl.-Ing. (MSc) degree from Dresden University of Technology in 2005 and the PhD degree from the KTH Royal Institute of Technology in 2012. Then, he returned to Dresden to lead a research team in micro-sensors and MEMS ICs for the Chair for Circuit Design and Network Theory. In 2013, he was appointed Lecturer (Assistant Professor) in the School of Electronic and Electrical Engineering, University of Leeds. His main research focuses on RFICs, RF MEMS, tuneable antennas, and RFIC-MEMS integration. Dr Somjit was the recipient of the Best Paper Award (EuMIC prize) at the European Microwave Week in 2009. He was awarded a Graduate Fellowship from the IEEE Microwave Theory and Techniques Society (MTT-S) in 2010 and 2011, and the IEEE Doctoral Research Award from the IEEE Antennas and Propagation Society in 2012. He was appointed a member of the Engineering, Physical and Space Science Research Panel of the British Council in 2014. He serves as a reviewer for various international journals, including IEEE Transactions on Microwave Theory and Techniques. Since 2013, he has been a member of the International Editorial Board of the International Journal of Applied Science and Technology. In 2016, he was the Chair of the Student Design Competition for the European Microwave Week.
Mitchai Chongcheawchamnan was born in Bangkok, Thailand. He received the BEng degree in Telecommunication from King Mongkut's Institute of Technology Ladkrabang, Bangkok in 1992, the MSc degree in Communication and Signal Processing from Imperial College London in 1995 and the PhD degree in Electrical Engineering from the University of Surrey, Guildford, UK, in 2001. He joined the Faculty of Engineering, Prince of Songkla University, Thailand, in 2008 as an Associate Professor. He has published more than 100 papers in international journals and conferences in RF, microwave and millimetre-wave engineering and agricultural applications. He has one international patent (pending), five national patents (pending) and three international innovation awards. Currently, he is a Director of Academic Outreach at the Prince of Songkla University, Hat Yai campus, Thailand.
First and foremost we would like to thank all those students (undergraduate, masters and PhD) and colleagues from industry and academia that have shared their experience with us over many years. Students, in particular, often asked fundamental questions that challenged our understanding of perceived wisdom in RF engineering – it is widely recognised these days that it is only when you teach a subject that you fully understand it, and we think that this has benefitted this book enormously. We would, in turn, like to thank all our own teachers, from school through to PhD study, who taught, guided and supported us, inspiring us to develop careers in engineering, with special thanks to Charles Turner, E.M. Deeley, P.R. Adby, Hamid Aghvami and Joachim Oberhammer.
We are very grateful to the people at Keysight Technologies, Plextek RFI, Phase 2 Devices, Rako Controls and Instrumentel for providing photographs to help put the text and diagrams into proper context. Some of the content has been informed by our own cutting-edge research and we are grateful to all those funding agencies that have supported us, especially the Engineering and Physical Sciences Research Council (EPSRC, UK), the European Commission, Vinnova (Sweden) and the Thailand Research Fund.
We are grateful for the assistance with diagrams and teaching materials provided by Umer Shah, Nemr Al Thalathiney, Hassan Al Nasser, Ali Alameer, Matthew Gillick, Ayodeji Sunday, Burawich Pamornnak, Sahapong Somwong, Kritsada Poungsuwan, Huda Kosumpan and Silachai Moongdee.
Mitchai Chongcheawchamnan would like to thank his colleagues at the Electrical Engineering (EE) Department, Faculty of Engineering, Prince of Songkla University (PSU) for providing this opportunity and supporting this book. Special thanks are due to Dr Kiattisak Wongsopanakul, Head of the EE department and colleagues from the Faculty of Engineering, who permitted sabbatical leave to allow time to write this book.
Finally, we would all like to thank our families for their love and support and for allowing us to spend so much time on this book instead of being with them.
Ian Robertson
Nutapong Somjit
Mitchai Chongcheawchamnan
April 2016
This book is aimed primarily at final year undergraduates and Masters students. It will also be invaluable as background reading for PhD students and as a primer for practising engineers in industry. Its primary purpose is to explain concepts in clear terms, with an emphasis on modern industry practice, with references for further reading given to provide more detailed information and background theory.
The book describes a full range of contemporary techniques for the design of transmitters and receivers for communications systems operating in the range from 1 through to 300 GHz. Within this frequency range there are many technologies that need to be employed, with silicon integrated circuits at the core but, compared to other electronic systems, with a much greater need for specialist devices and components for high performance – for example, low-loss passive components and low-noise and high-power compound semiconductor devices. Millimetre-waves (frequencies from 30 to 300 GHz) have rapidly been adopted for a wide range of consumer applications such as wireless high-definition video for virtual and augmented reality, 5G mobile systems, and automotive radars. It has taken many years to develop low-cost technologies for suitable transmitters and receivers, so previously these frequencies have been employed only in expensive military and space applications. This really does represent a new era in the use of the millimetre-wave part of the electromagnetic spectrum. The next 20 years will see explosive growth in the use of the frequency range from 30 to 300 GHz, and this requires engineers to be able to understand and apply the techniques of traditional microwave engineering, as well as the newer technologies such as silicon germanium and gallium nitride devices and integrated circuits. These are then assembled into sophisticated multichip modules and system-in-package products with integrated antenna arrays.
The book starts with an emphasis on the applications of microwave and millimetre-wave systems, in Chapter 1, followed by a description of the wide range of modern transmitter-receiver architectures in Chapter 2. The use of quadrature modulation schemes and modern direct-conversion transceivers, that are at the heart of nearly all wireless communication systems, are covered. Chapter 3 introduces S-parameters so that they can be used in Chapter 4 on Lumped Element Filters. This introduces Bode plots, transfer functions, poles and zeros and the s-domain, followed by design techniques for low-pass, high-pass, band-pass and bandstop filters. However, a key conclusion of this chapter is that lumped elements often suffer from serious limitations in high-frequency design, which is why transmission lines are needed for many circuits.
Chapter 5 introduces the main principles of transmission lines, including the telegrapher's equation, signal flowgraphs, standing waves, impedance transformation along a line and the Smith chart. This is followed by Chapter 6 on transmission line components, which is focused on the practical aspects of the main transmission line types – coaxial lines, rectangular waveguide, microstrip and various others, including coplanar waveguide (CPW) and substrate integrated waveguide (SIW). The emphasis is on those transmission line media that are used for circuit design, looking at their propagation characteristics, technologies and materials, discontinuities and modelling. A number of key standard components are introduced, such as the Wilkinson power divider, Lange coupler, branch-line coupler and rat-race hybrid.
