Ceramic Integration and Joining Technologies E-Book

• Herausgeber: John Wiley & Sons
• Kategorie: Fachliteratur
• Sprache: Englisch

Seitenzahl: 1330

Veröffentlichungsjahr: 2011

Beschreibung

This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage.

This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new integration technology and skillful adaptation of existing technology.

Leseprobe

Table of Contents

Cover

Title page

Copyright page

PREFACE

CONTRIBUTORS

PART I: INTRODUCTION

1 CERAMIC INTEGRATION ACROSS LENGTH SCALES: TECHNICAL ISSUES, CHALLENGES, AND OPPORTUNITIES

INTRODUCTION

INTEGRATION ISSUES IN ADVANCED TECHNOLOGY SYSTEMS

MICROELECTRONICS AND NANOELECTRONICS

ENERGY

AERONAUTICS AND GROUND TRANSPORTATION

INTEGRATION ACROSS DOMAINS AND LENGTH SCALES

SCIENCE AND TECHNOLOGY FOR MACROSCALE INTEGRATION

INTEGRATION ISSUES IN ENERGY GENERATION AND DEVICE FABRICATION

INTEGRATION ISSUES AT THE NANOSCALE AND IN BIOLOGICAL SYSTEMS

PART II: SCIENCE AND TECHNOLOGY FOR MACROSCALE INTEGRATION

2 CERAMIC COMPONENT INTEGRATION BY ADVANCED BRAZING TECHNOLOGIES

INTRODUCTION

WETTABILITY, RESIDUAL STRESSES, AND JOINT RELIABILITY

JOINT DESIGN

JOINING OF CMCS

CONCLUSIONS

ACKNOWLEDGMENTS

3 JOINING AND INTEGRATION ISSUES OF CERAMIC MATRIX COMPOSITES FOR THE NUCLEAR INDUSTRY

INTRODUCTION

ITER

JET

CONCLUSION

FUSION REACTORS BEYOND ITER

CMCS IN ADVANCED FISSION REACTORS

CONCLUSIONS

ACKNOWLEDGMENTS

4 AIR BRAZING: A NEW METHOD OF CERAMIC–CERAMIC AND CERAMIC–METAL JOINING

INTRODUCTION

METHODS OF CERAMIC BRAZING

THE AIR BRAZING CONCEPT

AIR BRAZE FILLER METAL DESIGN: THE Ag–CuO SYSTEM

COMPOSITIONAL MODIFICATIONS TO THE Ag–CuO SYSTEM

SUMMARY

5 DIFFUSION BONDING OF SILICON CARBIDE AS AN ENABLING TECHNOLOGY FOR THE FABRICATION OF COMPLEX-SHAPED CERAMIC COMPONENTS

INTRODUCTION

EXPERIMENTAL

RESULTS AND DISCUSSION

CONCLUSIONS

ACKNOWLEDGMENTS

6 INTEGRATION OF CARBON–CARBON COMPOSITE TO METALLIC SYSTEMS FOR THERMAL MANAGEMENT APPLICATIONS

INTRODUCTION

MATERIALS FOR THERMAL MANAGEMENT

CARBON–CARBON COMPOSITES

INTEGRATION OF CARBON AND C/C COMPOSITES WITH METALS

JOINT INTEGRITY, MICROSTRUCTURE, AND COMPOSITION

MECHANICAL PROPERTIES OF C–C COMPOSITE/METAL JOINTS

THERMAL AND THERMOMECHANICAL CONSIDERATIONS

SUMMARY AND FUTURE PROSPECTS

7 CONTACT INTERACTION IN CARBON–METAL SYSTEMS FOR JOINING AND INTEGRATION

INTRODUCTION

WETTING OF GRAPHITE AND DIAMOND BY METALS NONREACTIVE TO CARBON

WETTING OF GRAPHITE BY GROUP VIII METALS

CARBIDE-FORMING METALS IN CONTACT WITH CARBON

WETTING OF GRAPHITE BY NONREACTIVE TO CARBON MELTS WITH THE ADDITION OF CARBIDE-FORMING METALS

THE INTERRELATION BETWEEN THERMODYNAMIC AND INTERFACIAL ACTIVITIES OF COMPONENTS IN WETTING SOLIDS BY MELTS

WETTING OF GRAPHITE BY GROUP VIII METAL MELTS WITH THE ADDITION OF REACTIVE AND NONREACTIVE METALS

RELATIONSHIP BETWEEN THE PHASE DIAGRAMS, THE INTERFACE STRUCTURE AFTER HARDENING, AND THE TYPE OF WETTING ISOTHERM

HIGH-PRESSURE EFFECT ON WETTING OF GRAPHITE AND DIAMOND BY METAL MELTS

CONCLUSIONS

PART III: INTEGRATION ISSUES IN ENERGY GENERATION AND DEVICE FABRICATION

8 INTEGRATION TECHNOLOGIES FOR FERRITES AND POWER INDUCTORS IN CERAMIC CIRCUIT BOARDS

INTRODUCTION

DEVICE PHYSICS

SYNTHESIS OF FERRITES

MAGNETIC PROPERTIES

EMBEDDED POWER INDUCTORS

CERAMIC MULTILAYER TRANSFORMERS

CONCLUSION

ACKNOWLEDGMENTS

9 OXIDE THERMOELECTRIC POWER GENERATION

INTRODUCTION

THERMOELECTRIC POWER GENERATION

THERMOELECTRIC OXIDE MATERIALS

DEVICE TECHNOLOGY

MODULES

CONCLUSION

10 INTEGRATION TECHNOLOGIES FOR SOLID OXIDE FUEL CELLS (SOFCS) AND OTHER ELECTROCHEMICAL REACTORS

INTRODUCTION

BASIS OF ELECTROCHEMICAL REACTORS

SOFC AND RELATED RESEARCH AND DEVELOPMENT

MICRO-SOFC DEVELOPMENT

ELECTROCHEMICAL DE-NOX REACTOR AND OTHER APPLICATIONS FOR THE CLEAN CAR TECHNOLOGY

11 INTEGRATION TECHNOLOGIES FOR SENSORS

INTRODUCTION

MICRODISPENSING METHOD

DEVICE FABRICATION

SENSOR PERFORMANCE

SUMMARY

12 ON-CHIP INTEGRATION OF FUNCTIONAL HYBRID MATERIALS AND COMPONENTS IN NANOPHOTONICS AND OPTOELECTRONICS

MONOLITHIC INTEGRATION TECHNIQUES

NANOFABRICATION TECHNIQUES

GENERAL SELF-ASSEMBLY TECHNIQUES

SAMS

ASSEMBLY OF NANOCRYSTALS

ALIGNMENT OF NANORODS USING DC ELECTRIC FIELD

ASSEMBLY OF NANOSTRUCTURES USING DEP AND OPTOELECTRONIC TWEEZERS (OETS)

NANOSKYVING: A NEW METHOD TO PRODUCE ARRAYS OF NANOSTRUCTURES

13 INTEGRATION OF MULTIFUNCTIONAL PROPERTIES IN THERMAL BARRIER COATINGS BY CHEMICAL VAPOR DEPOSITION

INTRODUCTION

TBC PROCESS

HIGH-SPEED COATING BY CONVENTIONAL CVD

HIGH-SPEED COATING BY LASER CVD

SUMMARY

14 THE CHANGING PHYSICS IN METAL INTERCONNECT RELIABILITY

BRIEF OVERVIEW OF INTERCONNECTION FAILURES

THE CHANGING PHYSICS OF EM

THE CHANGING PHYSICS OF SOLDER JOINT FAILURE

CONCLUSIONS

15 INTEGRATION ISSUES OF BARIUM STRONTIUM TITANATE THIN FILM FOR TUNABLE MICROWAVE APPLICATIONS

INTRODUCTION

BST DEVICE TECHNOLOGY FOR TUNABLE MICROWAVE APPLICATIONS

BST: STRUCTURE AND PROPERTIES

BST VARACTOR TECHNOLOGY

DEPOSITION TECHNOLOGIES FOR BST THIN FILMS

PROPERTIES INFLUENCING INTEGRATION ISSUES IN BST THIN FILMS

SUMMARY

ACKNOWLEDGMENTS

16 AEROSOL DEPOSITION (AD) INTEGRATION TECHNIQUES AND THEIR APPLICATION TO MICRODEVICES

INTRODUCTION

AD METHOD

ROOM TEMPERATURE IMPACT CONSOLIDATION (RTIC)

DEPOSITION PROPERTIES AND FILM PATTERNING

OTHER SIMILAR METHODS AND COMPARISON WITH THE AD METHOD

ELECTRICAL PROPERTIES OF AD FILMS

DEVICE APPLICATION

SUMMARY

ACKNOWLEDGMENTS

PART IV: NANO- AND BIOINTEGRATION

17 ADVANCES IN NANOINTEGRATION METHODOLOGIES: PATTERNING, POSITIONING, AND SELF-ASSEMBLY

INTRODUCTION

NI OF CERAMICS

NI OF PARTICLE ASSEMBLIES

18 INTEGRATION OF NANOWIRES IN NEW DEVICES AND CIRCUIT ARCHITECTURES: RECENT DEVELOPMENTS AND CHALLENGES

INTRODUCTION

1-D NANOSCALE BUILDING BLOCKS: SYNTHESIS AND GROWTH MECHANISM

STRUCTURE–PROPERTY CHARACTERIZATION AND RELATIONSHIP

DEVELOPMENT OF NANODEVICE ARCHITECTURES

SUMMARY

ACKNOWLEDGMENTS

19 INTEGRATING DIAMOND- LIKE CARBON INTO NANOSTRUCTURE DESIGNS (FABRICATING MICROSCALE AND NANOSCALE ARCHITECTURES OF DIAMOND-LIKE CARBON FILMS)

BASICS OF MICROMECHANICAL AND NANOMECHANICAL DEVICES

PREPARATION AND PROPERTIES OF DLC

DLC MECHANICAL DEVICES: FABRICATION AND PERFORMANCE

THE FUTURE OF DLC MICRO/NANOARCHITECTURES

ACKNOWLEDGMENT

20 SYNTHESIS, PROPERTIES, INTEGRATION, AND APPLICATIONS OF VERTICALLY ALIGNED CERAMIC NANOSTRUCTURES

INTRODUCTION

VERTICALLY ALIGNED CERAMIC NANOSTRUCTURE SYNTHESIS METHODS

PROPERTIES OF 1-D NANOSTRUCTURES

APPLICATIONS OF NANOWIRES AND INTEGRATION WITH THE DEVICES

21 NANOINTEGRATION BASED ON THIN-FILM TECHNOLOGY

INTRODUCTION

SPONTANEOUS ORDERING OF NANOSTRUCTURES

SELF-ORGANIZATION WITH TEMPLATE OR SCREENING METHODS

VLS GROWTH

PATTERNING TECHNIQUES

PHOTOLITHOGRAPHY AND ELECTRON-BEAM LITHOGRAPHY

NANOLITHOGRAPHY

NANOWIRE ELECTRONICS

SUMMARY

22 MASS-MANUFACTURABLE NANOWIRE INTEGRATION: CHALLENGES AND RECENT DEVELOPMENTS

INTRODUCTION

NANOWIRE FABRICATION

NANOWIRE ALIGNMENT AND POSITIONING

NANOWIRE INTERCONNECTION

BRIDGED NANOWIRES

CONCLUSION

ACKNOWLEDGMENTS

23 USABILITY OF INK-JET PRINTING TECHNOLOGY AND NANOMATERIALS IN ELECTRICAL INTERCONNECTIONS, ELECTRONIC PACKAGING, AND SYSTEM INTEGRATION FOR MICROELECTRONICS APPLICATIONS

INTRODUCTION

PRINTABLE ELECTRONICS AND INK-JET PRINTING TECHNOLOGIES

NANOPARTICLES AND THEIR APPLICABILITY TO INK-JET PRINTING TECHNOLOGY

INK-JET PRINTING IN MICROELECTRONICS APPLICATIONS

THE ENVIRONMENTAL ASPECTS OF PRINTABLE ELECTRONICS

CONCLUSIONS

24 BIOINTEGRATION OF PROSTHETIC DEVICES

INTRODUCTION

STRUCTURE OF BONE

CERAMICS FOR ARTIFICIAL JOINTS

CERAMICS FOR BONE SUBSTITUTES

BIOINTEGRATION BETWEEN BIOACTIVE CERAMICS AND LIVING BONE

REQUIREMENT FOR ARTIFICIAL MATERIALS TO FORM APATITE

FUNCTIONAL GROUPS EFFECTIVE FOR APATITE NUCLEATION

BIOACTIVE METALS

BIOACTIVE CERAMICS–POLYMER COMPOSITE

BIOACTIVE INORGANIC–ORGANIC HYBRIDS

BIOACTIVE CEMENTS

SUMMARY

Index

Copyright © 2011 by The American Ceramic Society. All rights reserved.

Published by John Wiley & Sons, Inc., Hoboken, New Jersey.

Published simultaneously in Canada.

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Library of Congress Cataloging-in-Publication Data:

Ceramic integration and joining technologies : from macro to nanoscale / editors: Mrityunjay Singh . . . [et al.].

p. cm.

 Includes index.

ISBN 978-0-470-39122-8 (hardback)

 1. Ceramic materials. 2. Manufacturing processes. 3. Joints (Engineering) I. Singh, M. (Mrityunjay)

 TA455.C43C4626 2011

 620.1'4–dc22

2010053092

oBook ISBN: 978-1-118-05677-6

ePDF ISBN: 978-1-118-05675-2

ePub ISBN: 978-1-118-05676-9

PREFACE

There is an ever-increasing interest in research and development on integration technologies across length scales driven by the discovery of new materials and demonstration of their application potential. New and emerging materials require adaptive or innovative approaches to integrate them into components, assemblies, devices, and systems. Integration is, therefore, pervasive and cuts across disciplinary boundaries. It is recognized as a key enabling technology that connects innovation in materials with manufacturing. Yet, at present, there is no book-length treatment of integration of advanced materials, particularly ceramics offering authoritative and comprehensive coverage of innovative research on integration bridging various research domains. Much of the technical know-how on integration is either privy to the practitioners within such domains or those with special interest in it.

It is this pervasive nature of integration and current scarcity of a comprehensive resource dealing with it that motivated us to present the state of the art on ceramic integration in diverse fields in a single volume. The collective knowledge presented in the 24 chapters of this volume captures the diversity and unity of joining and integration methodologies across disciplines and length scales. The book addresses joining and integration issues at the macro-, micro- and nanoscales in diverse areas such as aerospace, nuclear and thermoelectric power, microelectromechanical systems, solid oxide fuel cells, multichip modules, prosthetic devices, and many others. The book envisions integration in a broad sense as a key enabler of advanced technology.

Our contributors, all frontline researchers and practitioners in their respective technical areas, represent universities, industry, and government and private research organizations of 12 different nations. They present contemporary perspectives on how integration is viewed and implemented in key application areas within their respective fields. We hope that this volume will stimulate fresh thinking and exchange of ideas and information on approaches to ceramic integration across fields and offer seminal insights into transformative solutions to challenges of integrating new and emerging materials into advanced technology components and systems.

New or transformative knowledge is not discovered in the same logical and structured manner as organized knowledge that gives identity to a discipline. New pathways often emerge from synergy between innovative and evolving approaches within diverse fields that conceivably lack commonality. It is our belief that such synergies may be facilitated by bringing a truly diverse group of practitioners on a common platform. World-class educational and research institutions across continents have begun to incorporate knowledge about integration into their professional studies curricula to train students in this niche area of materials and manufacturing. We believe that the book will serve the educational and research needs of both practitioners and graduate students involved and interested in joining and integration. Whereas the book does not aim to establish the pedagogical foundation in the science and technology of joining and integration, it provides in-depth cutting-edge treatment of selected areas that are widely recognized to be of critical importance.

We are grateful to all of our revered authors for their valuable contribution. We are indebted to John Wiley & Sons and their publication staff, in particular Rebekah Amos, for her wonderful support during the preparation of the book.

Mrityunjay Singh

Ohio Aerospace Institute, NASA Glenn Research Center, USA

Tatsuki Ohji

National Institute of Advanced

Industrial Science and Technology (AIST), Japan

Rajiv Asthana

University of Wisconsin-Stout, USA

Sanjay Mathur

University of Cologne, Germany

CONTRIBUTORS

R. Aggarwal, Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC

Jun Akedo, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Ibaraki, Japan

Rajiv Asthana, University of Wisconsin-Stout, Department of Engineering and Technology, Menomonie, WI

Masanobu Awano, National Institute of Advanced Industrial Science and Technology (AIST), Shimo-Shidami, Moriyama-ku, Nagoya, Japan

S. Barth, Department of Chemistry, University College Cork, Cork, Ireland

Umur Caglar, Department of Electronics, Tampere University of Technology, Tampere, Finland

Valentina Casalegno, Politecnico di Torino, Dipartimento di Scienza dei Materiali e Ingegneria, Chimica-DISMIC, Torino, Italy

Daniel H. C. Chua, Department of Materials Science and Engineering, National University of Singapore, Singapore

J. T. Darsell, Energy Science and Technology Division, Pacific Northwest National Laboratory, Richland, WA

Hilmi Volkan Demir, Department of Electrical and Electronics Engineering, and Department of Physics, Nanotechnology Research Center, and Institute of Materials Science and Nanotechnology, Bilkent University, Ankara, Turkey

Talha Erdem, Department of Electrical and Electronics Engineering, Department of Physics, Nanotechnology Research Center, and Institute of Materials Science and Nanotechnology, Bilkent University, Ankara, Turkey

Monica Ferraris, Politecnico di Torino, Dipartimento di Scienza dei Materiali e Ingegneria Chimica-DISMIC, Torino, Italy

Delphine Flahaut, National Institute of Advanced Industrial Science and Technology (AIST), Ikeda, Osaka, Japan

Yoshinobu Fujishiro, National Institute of Advanced Industrial Science and Technology (AIST), Shimo-Shidami, Moriyama-ku, Nagoya, Japan

Ryoji Funahashi, National Institute of Advanced Industrial Science and Technology (AIST), Ikeda, Osaka, Japan

Takashi Goto, Institute for Materials Research, Tohoku University, Aoba-ku, Sendai, Japan

Venkataraman Gurumurthy, Electrical Engineering Department and Nanotechnology Research and Education Center, University of South Florida, Tampa, FL

Michael C. Halbig, U.S. Army Research Laboratory, Vehicle Technology Directorate-Glenn Site, NASA Glenn Research Center, Cleveland, OH

Koichi Hamamoto, National Institute of Advanced Industrial Science and Technology (AIST), Shimo-Shidami, Moriyama-ku, Nagoya, Japan

F. Hernández-Ramírez, EME/XaRMAE/IN2UB, Department of Electronics, University of Barcelona, Barcelona, Spain

Yuejin Hou, Division of Circuits and Systems, School of EEE, Nanyang Technological University, Singapore

M. Saif Islam, Integrated Nanodevices and Systems Research, Electrical and Computer Engineering, University of California, Davis, CA

Jolanta Janczak-Rusch, EMPA, Swiss Federal Laboratories for Materials Science and Technology, Dübendorf, Switzerland

C. Jin, Joint Department of Biomedical Engineering, University of North Carolina, Chapel Hill, NC

Masakazu Kawashita, Graduate School of Biomedical Engineering, Tohoku University, Aoba-ku, Sendai, Japan

Supriya Ketkar, Electrical Engineering Department and Nanotechnology Research and Education Center, University of South Florida, Tampa, FL

J. Y. Kim, Energy Science & Technology Division, Pacific Northwest National Laboratory, Richland, WA

Atsuko Kosuga, National Institute of Advanced Industrial Science and Technology (AIST), Ikeda, Osaka, Japan

Kunihito Koumoto, Graduate School of Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, Japan

Ashok Kumar, Mechanical Engineering Department and Nanotechnology Research and Education Center, University of South Florida, Tampa, FL

Xijun Li, Department of Materials Science and Engineering, National University of Singapore, Singapore

O. B. Loginova, V.N. Bakul Institute for Superhard Materials, National Academy of Sciences of Ukraine, Kiev, Ukraine

Pauliina Mansikkamäki, Department of Electronics, Tampere University of Technology, Tampere, Finland

Yoshitake Masuda, National Institute of Advanced Industrial Science and Technology (AIST), Shimo-Shidami, Moriyama-ku, Nagoya, Japan

S. Mathur, Institute of Inorganic Chemistry, University of Cologne, Cologne, Germany

Ichiro Matsubara, National Institute of Advanced Industrial Science and Technology (AIST), Shimo-Shidami, Moriyama-ku, Nagoya, Japan

Richard Matz, Siemens Corporate Technology, Munich, Germany

Toshiki Miyazaki, Graduate School of Life Science and Systems Engineering, Kyushu Institute of Technology, Wakamatsu-ku, Kitakyushu, Japan

R. J. Narayan, Joint Department of Biomedical Engineering, University of North Carolina, Chapel Hill, NC

Maiko Nishibori, National Institute of Advanced Industrial Science and Technology (AIST), Shimo-Shidami, Moriyama-ku, Nagoya, Japan

Tatsuki Ohji, National Institute of Advanced Industrial Science and Technology (AIST), Shimo-Shidami, Moriyama-ku, Nagoya, Japan

Chikara Ohtsuki, Graduate School of Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, Japan

Jussi Pekkanen, Department of Electronics, Tampere University of Technology, Tampere, Finland

Ville Pekkanen, Department of Electronics, Tampere University of Technology, Tampere, Finland

V. M. Perevertailo, V.N. Bakul Institute for Superhard Materials, National Academy of Sciences of Ukraine, Kiev, Ukraine

D. Pliszka, Nanoscience and Nanotechnology Initiative, National University of Singapore, Singapore, and Institute of Physics, Pomeranian University in Slupsk, Slupsk, Poland

J. D. Prades, EME/XaRMAE/IN2UB, Department of Electronics, University of Barcelona, Barcelona, Spain

S. Ramakrishna, Nanoscience and Nanotechnology Initiative, Department of Mechanical Engineering, and Division of Bioengineering, National University of Singapore, Singapore

A. Romano-Rodriguez, EME/XaRMAE/IN2UB, Department of Electronics, University of Barcelona, Barcelona, Spain

Milena Salvo, Politecnico di Torino, Dipartimento di Scienza dei Materiali e Ingegneria Chimica-DISMIC, Torino, Italy

Nigel M. Sammes, Department of Metallurgical and Materials Engineering, Colorado School of Mines, Golden, CO

Ataur Sarkar, Integrated Nanodevices and Systems Research, Electrical and Computer Engineering, University of California, Davis, CA

H. Shen, Inorganic and Materials Chemistry, University of Cologne, Cologne, Germany

Woosuck Shin, National Institute of Advanced Industrial Science and Technology (AIST) Shimo-Shidami, Moriyama-ku, Nagoya, Japan

Mrityunjay Singh, Ohio Aerospace Institute, NASA Glenn Research Center, Ceramics Branch, Cleveland, OH

S. Sundarrajan, Nanoscience and Nanotechnology Initiative, National University of Singapore, Singapore

Toshio Suzuki, National Institute of Advanced Industrial Science and Technology (AIST), Shimo-Shidami, Moriyama-ku, Nagoya, Japan

Cher Ming Tan, Division of Circuits and Systems, School of EEE, Nanyang Technological University, Singapore

Saori Urata, National Institute of Advanced Industrial Science and Technology (AIST), Ikeda, Osaka, Japan

Jani Valkama, Department of Electronics, Tampere University of Technology, Tampere, Finland

W. Wei, Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC

K. S. Weil, Energy Science & Technology Division, Pacific Northwest National Laboratory, Richland, WA

Toshiro Yamaguchi, National Institute of Advanced Industrial Science and Technology (AIST), Shimo-Shidami, Moriyama-ku, Nagoya, Japan

PART I: INTRODUCTION

1

CERAMIC INTEGRATION ACROSS LENGTH SCALES: TECHNICAL ISSUES, CHALLENGES, AND OPPORTUNITIES

Mrityunjay Singh,1 Tatsuki Ohji,2 Rajiv Asthana,3 and Sanjay Mathur4

1Ohio Aerospace Institute, NASA Glenn Research Center, Cleveland, Ohio

2National Institute of Advanced Industrial Science and Technology (AIST), Nagoya, Japan

3University of Wisconsin-Stout, Menomonie, Wisconsin

4University of Cologne, Cologne, Germany

INTRODUCTION

The discovery of new and innovative materials has been known to culminate in major turning points in human history. The Bronze Age, the Iron Age, and, in our own times, the age of silicon are all considered as historical benchmarks that have transformed human civilization and have opened theretofore unforeseen possibilities for economic growth and societal impact. These progressive and defining periods in the history of humankind are marked not only by materials innovations (e.g., Damascus steel, used to make swords during 1100–1700 AD) but also, more importantly, by the transformation of new materials into goods usable for war, the arts, and commerce. The transformative impact and functional manifestation of new materials have been demonstrated in every historical era by their integration into new products, systems, assemblies, and devices.

INTEGRATION ISSUES IN ADVANCED TECHNOLOGY SYSTEMS

In modern times, the integration of new materials into usable products has a special relevance for the technological development and economic competitiveness of industrial societies. Current and evolving integration issues span such diverse areas as aeronautics, space, energy, nuclear power, thermoelectric (TE) power, nanoelectromechanical and microelectromechanical systems (MEMS), solid oxide fuel cells (SOFCs), multichip modules (MCMs), prosthetic devices, and many others.

MICROELECTRONICS AND NANOELECTRONICS

Integration is critically important in microelectronics at the wafer, chip, and package levels and is a means to achieving compact designs and cost reduction. Integration technology is used in the manufacture of MEMS, display devices, radio frequency (RF) components, and a number of other microelectronic components. In such applications, integration challenges are manifested in soldering, metallization, service reliability, joint degradation, vacuum seals, and other areas. Highly complex and sophisticated integration technologies are used in the construction of devices with semiconductor chips and in the development of methods to connect MEMS components.

MCMs integrate a number of unique functions into a system and consist of a group of advanced functional electronic devices that permit size reduction. MCMs combine integrated circuits (ICs) based on different materials and provide reliable low-cost integration technology to combine several ICs with a functional substrate. MCMs are designed based on thin-film multilayer structures on ceramic, silicon or metal that can offer the highest integration density per layer. They are usually built using joining and surface modification technology, such as sputtering and plating. The biggest advantage of joining is the ability to join any dissimilar materials if their surface mechanical properties, in terms of flatness, smoothness, and cleanliness, are sufficiently good.