Micro-Manufacturing E-Book

• Herausgeber: John Wiley & Sons
• Kategorie: Fachliteratur
• Sprache: Englisch

Seitenzahl: 624

Veröffentlichungsjahr: 2011

Beschreibung

This book is the first of its kind to collectively address design-based and mechanical micro-manufacturing topics in one place. It focuses on design and materials selection, as well as the manufacturing of micro-products using mechanical-based micro-manufacturing process technologies. After addressing the fundamentals and non-metallic-based micro-manufacturing processes in the semiconductor industry, it goes on to address specific metallic-based micro-manufacturing processes, such as: micro-forming, micro-machining, micro-molding, micro-laser processing, micro-layered manufacturing, micro-joining, micro-assembly and materials handling, and microEDM and ECM. The book provides an in-depth understanding of materials behavior at micro-scales and under different micro-scale processing conditions, while also including a wide variety of emerging micro-scale manufacturing issues and examples.

Leseprobe

Table of Contents

Title Page

Copyright

Foreword

Contributors

Chapter 1: Fundamentals of Micro-manufacturing

1.1 Introduction

1.2 Micro-forming (Micro-scale Deformation Processes)

1.3 Micro-machining for Discrete Part Micro-manufacturing

References

Chapter 2: Micro-Fabrication Processes in Semiconductor Industry

2.1 Introduction

2.2 Semiconductor Substrates

2.3 Chemical Vapor Deposition (CVD)

2.4 Lithography

2.5 Physical Vapor Deposition (PVD)

2.6 Dry Etching Techniques

2.7 Wet Bulk Micro-machining

2.8 Summary

References

Chapter 3: Modeling and Analysis at Micro-scales

3.1 Introduction

3.2 Limitation of Continuum Models at Micro-scales

3.3 Modified Continuum Models

3.4 Molecular Dynamics Models and Disadvantages

3.5 Examples of Micro-scale Modeling Approaches and Cross-Comparisons

3.6 Summary, Conclusions and Remaining Research Issues

Chapter 4: Metrology, Inspection, and Process Control in Micro-scales

4.1 Introduction

4.2 Spatial Metrology

4.3 Digital Holographic Microscope Systems

4.4 Micro Coordinate Measuring Machines—μCMM

4.5 Scanning Probe Microscopy

4.6 Metrology of Mechanical Properties

References

Chapter 5: Micro-Layered Manufacturing

5.1 Introduction

5.2 Layered Manufacturing Processes

5.3 Materials and Layered Manufacturing Capabilities

5.4 Applications of Layered Manufacturing Technologies

5.5 Future Directions

References

Chapter 6: Micro-laser Processing

6.1 Introduction

6.2 Laser Radiation, Absorption, and Thermal Effects

6.3 Laser Processing of Materials

6.4 Laser Processing Parameters

6.5 Ultrashort-Pulsed Laser Ablation

6.6 Nanosecond-Pulsed Laser Ablation

6.7 Laser Shock Peening

References

Chapter 7: Polymer Micro-molding/Forming Processes

7.1 Introduction

7.2 Polymers for Micro-Molding

7.3 Taxonomy of Micro-Molding Processes

7.4 General Process Dynamics of Micro-Molding

7.5 Micro-Injection Molding

7.6 Hot Embossing

7.7 Micro-Mold Fabrication

7.8 Summary and Ongoing Research

References

Chapter 8: Mechanical Micro-machining

8.1 Introduction

8.2 Material Removal at Micro-scale

8.3 Tool Geometry, Tool Wear, and Tool Deflections

8.4 Micro-turning

8.5 Micro-End-Milling

8.6 Micro-Drilling

8.7 Micro-Grinding

8.8 Micro-Machine Tools

References

Chapter 9: Micro-forming

9.1 Introduction

9.2 Micro-forging

9.3 Micro-embossing/Coining

9.4 Micro-extrusion

9.5 Micro-bending

9.6 Micro-stamping

9.7 Micro-Deep Drawing

9.8 Micro-hydroforming

9.9 Equipment and Systems for Micro-forming Applications

9.10 Summary and Future Work

References

Chapter 10: Micro-Electro Discharge Machining (μEDM)

10.1 Introduction

10.2 The Micro-EDM Process

10.3 Micro-EDM Process Control Parameters

10.4 Micro-EDM Process Performance Measurements

10.5 Micro-EDM Process Applications and Examples

10.6 Recent Developments and Research on Micro-EDM

10.7 Summary

References

Chapter 11: Metal Injection Molding at Micro-Scales (μMIM)

11.1 Introduction to Metal Injection Molding (MIM)

11.2 Micro Metal Injection Molding (μMIM)

11.3 Feedstock Preparation

11.4 Injection Molding

11.5 Debinding

11.6 Sintering

11.7 Summary

References

Bplates

Index

Copyright © 2010 by John Wiley & Sons, Inc. All rights reserved.

Published by John Wiley & Sons, Inc., Hoboken, New Jersey.

Published simultaneously in Canada.

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Library of Congress Cataloging-in-Publication Data:

Includes index.

ISBN 978-0-470-55644-3

Foreword

Since early 1990s, there has been an increasing demand for compact, integrated and miniature products for use in our daily lives as well as for industrial applications. Consumer products that we use and interact with every day are not only continuously getting smaller, but also are loaded with more integrated multi-functionalities. Similar trends have also taken place in other devices such as portable and distributed power generation devices (batteries, fuel cells, micro-turbines), electronic cooling systems, medical devices (pace makers, catheters, stents), sensors, etc. As a consequence, components for such devices and systems also get smaller down to micro/meso-scales, with a near future expectation into nano-scales. Micro-fabrication techniques for silicon materials have been well established and utilized in manufacturing of micro-electronics devices. There have been hundreds, if not thousands, of books written about semiconductors, micro-electronics and related micro-fabrication processes. Hence, their adaptation is apparent for systems such as Micro-Electromechanical-Systems (MEMS) for use in aforementioned miniature devices and products. However, these techniques are mostly limited to silicon as a starting material. When complex and integrated products are required, for cost effective design and use of metallic components, thus far, well-known macro-fabrication methods such as forming and machining were adapted into micro/meso-scales mainly using intuition and experience.

In this work, a collection of esteemed authors from a broad range of backgrounds and institutions worldwide has prepared, possibly one of the first extensive books on micro-manufacturing processes for mainly non-silicon materials. The main goal was to gather the experience, technological know-how and scientific findings in a wide variety of topics and applications in a synergistic and coherent book for the benefit of students, researchers, engineers, managers and teachers who would start their investigations studies, preparations or careers with a concise set of information.

The first chapter, written by Drs. M. Koç and T. Özel, summarizes the recent developments and findings on micro-manufacturing, including the size effects, applications, tooling, etc., reported in the literature with examples and applications. In the second chapter, prepared by Dr. K. Teker, a summary of well-known micro-fabrication methods for silicon materials is presented to allow readers to compare them with the processes described in the rest of the book. The third chapter, which is prepared by Drs. T. Makino and K. Dohda, describes the issues in modeling and analysis for micro-manufacturing processes along with a comparison of different modeling approaches. Drs. O. Karhade and T. Kurfess present metrology, inspection and quality control aspects at micro-scales, and describe alternative methods to do so. Dr. A. Bandyophadyay and his colleagues discuss micro-layered manufacturing processes to be used for medical devices, sensors, etc. made out of metals and plastics in Chapter 5. In Chapter 6, Dr. Wu and Dr. Özel describe some of the micro-manufacturing processes based on laser processing with several examples and discuss long and short pulsed laser-material interactions. Micro Injection Molding process for polymers is presented by Dr. Yao in Chapter 7 while Micro-mechanical Machining is introduced in Chapter 8 by Dr. Özel and his associate. Dr. Koç prepared Chapter 9 with his colleague Dr. Mahabunphachai on micro-forming processes such as micro-forging, micro-stamping, micro-hydroforming and size effects. Dr. Rahman and his group cover in Chapter 10 micro-EDM processes including descriptions of equipment development. Dr. Fu Gang explains the micro Metal Injection Molding process in Chapter 11 with several examples of applications.

We would like to thank all of the authors who contributed to this book. We also extend our thanks to Ms. Anita Lekhwani of John Wiley who assisted us in all stages of preparing this book for the publication.

MUAMMER KOÇ and TUĞRUL ÖZEL

June 2010

Contributors

ABU BAKAR, Mechanical Engineering Department, National University of Singapore (NUS), Singapore

ALI ASAD, Mechanical Engineering Department, National University of Singapore (NUS), Singapore

VAMSI K. BALLA, The School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington

AMIT BANDYOPADHYAY, The School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington

SHELDON A. BERNARD, The School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington

SUSMITA BOSE, The School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington

KUNIAKII DOHDA, Professor, Department of Engineering Physics, Electronics & Mechanics, Nagoya Institute of Technology, Nagoya, Japan

GANG FU, Mechanical Engineering Department, Nanyang Technological University (NTU), Singapore

MUHAMMAD PERVEJ JAHAN, Mechanical Engineering Department, National University of Singapore (NUS), Singapore

OMKAR G. KARHADE, Process Technology Development Engineer, Intel Corporation, Chandler, Arizona

MUAMMER KOÇ, Associate Professor & Director, Center for Precision Forming, (CPF- National Science Foundation IUCRC), Virginia Commonwealth University (VCU), Richmond, VA; Istanbul SEHIR University, Turkey

THOMAS KURFESS, Professor and BMW Chair of Manufacturing, Clemson University, International Center for Automotive Research, Clemson, South Carolina

NGIAP HIANG LOH, Mechanical Engineering Department, Nanyang Technological University (NTU), Singapore

SASAWAT MAHABUNPHACHAI, National Metal and Materials Technology Center (MTEC), Pathumthani, Thailand

TAKEHIKO MAKINO, Assistant Professor, Department of Engineering Physics, Electronics & Mechanics, Nagoya Institute of Technology, Nagoya, Japan

TAKESHI MASAKI, Mechanical Engineering Department, National University of Singapore (NUS), Singapore

TUĞRUL ÖZEL, Associate Professor & Director, Manufacturing Automation Research Laboratory, School of Engineering, Industrial and Systems Engineering, Rutgers University, Piscataway, New Jersey

MUSTAFIZUR RAHMAN, Professor, Mechanical Engineering Department, National University of Singapore (NUS), Singapore

BEE YEN TAY, Mechanical Engineering Department, Nanyang Technological University (NTU), Singapore

KASIF TEKER, Assistant Professor, Department of Physics & Engineering, Frostburg State University, Maryland, Maryland

THANONGSAK THEPSONTHI, Manufacturing Automation Research Laboratory Industrial & Systems Engineering Rutgers, The State University of New Jersey, Piscataway, New Jersey

SHU BENG TOR, Mechanical Engineering Department, Nanyang Technological University (NTU), Singapore

YOKE SAN WONG, Mechanical Engineering Department, National University of Singapore (NUS), Singapore

BENXIN WU, Assistant Professor, Mechanical Engineering, Laser-based Manufacturing and Applications Laboratory, Illinois Institute of Technology, Chicago, Illinois

DONGGANG YAO, Associate Professor, School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia

Chapter 1

Fundamentals of Micro-manufacturing

Muammer Koç

Center for Precision Forming (CPF—National Science Foundation IUCRC), Virginia

Commonwealth University, Richmond, VA

Istanbul Sehir University, Turkey

Tugrul Özel

Manufacturing Automation Research Laboratory, School of Engineering, Industrial and Systems Engineering, Rutgers University, Piscataway, New Jersey

1.1 Introduction

During the last decade, there has been a continuing trend of compact, integrated and smaller products such as (i) consumer electronics—cell phones, PDAs (personal digital assistant), etc.; (ii) micro- and distributed power generators, turbines, fuel cells, heat exchangers (1, 2, 3, 4); (iii) micro-components/features for medical screening and diagnostic chips, controlled drug delivery and cell therapy devices, biochemical sensors, Lab-on-chip systems, stents, etc. (5, 6, 7, 8); (iv) micro-aerial vehicles (MAV) and micro-robots (9, 10, 11, 12); and (v) sensor and actuators (13, 14) (Fig. 1.1). This trend requires miniaturization of components from meso- to micro-levels. Currently, micro-electromechanical systems (MEMS), mostly limited to silicon, are widely researched and used for miniaturized systems and components using layered manufacturing techniques such as etching, photolithography, and electrochemical deposition (15, 16). Such techniques are heavily dependent on technologies and processes originally developed for micro-electronics manufacturing. However, MEMS have some limitations and drawbacks in terms of (i) material types (limited to silicon in combination with sputtered and etched thin metallic coatings), (ii) component geometries (limited to 2D and 2.5D), (iii) performance requirements (i.e., types of mechanical motions that can be realized, durability, and strength), and (iv) cost (due to slow and sequential nature of processes that are not amenable to mass production).

Figure 1.1 (a) Micro-channel chemical reactor, components are manufactured by laser micro-machining (20); (b) pattern of concentric 127 μm channels of varying depth up to 125 μm cut into a brass workpiece; (c) SEM photograph of the front view of the 127 μm diameter two-flute end mill (21).

These issues lead the way for researchers to seek alternative ways of producing 3D micro-components with desired durability, strength, surface finish, and cost levels using metallic alloys and composites. Micro-machining processes have been widely used and researched for this purpose (15, 16, 17). For instance, the laser micro-machining is used to fabricate micro-structures (channels, holes, patterns) as small as 5 μm in plastics, metals, semiconductors, glasses, and ceramics. Aspect ratios of 10:1 are claimed to be possible with this process. As a result, micro-scale heat exchangers, micro-membranes, micro-chemical-sensors and micro-scale molds can be fabricated with micro-machining. However, these processes are not appropriate for high-volume-low-cost applications (18, 19). Figure 1.2 depicts representative parts and features manufactured using mechanical micro-machining process.

Figure 1.2 (a) lead frame (pitch 300 μm) blanks stamped for electronic connectors (19); (b) Sample micro-extruded/forged parts.

As an alternative, micro-forming (micro-extrusion, micro-embossing, micro-stamping, micro-forging, etc.) processes have been considered and researched as a prominent processing method because of their potential capabilities to produce a large volume of components cost-effectively (19, 22, 23, 24, 25). Examples of micro-extruded parts are shown in Fig. 1.2. Micro-forming poses some difficulties because of the size and frictional effects associated with material forming processing. For micro-components in the ranges of interest (0.1–5 mm), the surface area/volume ratio is large, and surface forces play important roles. As the ratio of feature size to grain size becomes smaller, deformation characteristics change abruptly with large variations in the response of material (26). Thus, new concepts are needed to extend forming processes to micro-levels. Early research attempts indicate that micro-forming is feasible but fundamental understanding of material, deformation, and tribological behavior in micro-/meso-scale is necessary for successful industrialization of micro-forming (24, 27).

The development of novel methods and use of alternative instruments for accurate and cost-effective measurement of material properties are needed in micro-forming process and tool and product design. As is well known, both solids and fluids exhibit different properties at the micro-scopic scale. As the size scale is reduced, surface and size effects begin to dominate material response and behavior. Consequently, material properties obtained on regular scale specimens are no longer valid for accurate analysis and further design. Mechanical, tribological, and deformation properties deviate from bulk values as the characteristic size of the micro-components approaches the size scale of a micro-structure, such as the grain size in polycrystalline materials (22, 27). The ultimate challenge and the fundamental underlying barrier in the advancement of micro-forming processes are to be able to characterize these properties at the micro-scale in an accurate and reasonably cost-effective manner.