Nano and Micromachining E-Book

• Herausgeber: John Wiley & Sons
• Kategorie: Wissenschaft und neue Technologien
• Sprache: Englisch

Seitenzahl: 294

Veröffentlichungsjahr: 2013

Beschreibung

This book provides the fundamentals and recent advances in nano and micromachining for modern manufacturing engineering. It begins by providing an outline of nanomachining with emphasis being given to molecular dynamics, cutting, and chip formation, before discussing various advances in field and machining processes, including advances in diamond cutting tools, conventional processes (microturning, microdrilling, micromilling, etc.), grinding and ultra-precision processes, and non-conventional machining processes (laser micromachining, EDM micromachining, etc.). The coverage concludes with an evaluation of subsurface damages in nano and micromachining and a presentation of applications in industry. As such, not only is this book useful to those studying engineering or machining at both an undergraduate and postgraduate level, but it also serves as a useful reference guide for academics and engineers involved in these areas and related industries.

Leseprobe

Table of Contents

Preface

Chapter 1. Nanoscale Cutting

1.1. Introduction

1.2. Basic elements of molecular dynamics modeling

1.3. Design and requirements for state-of-the-art MD cutting process simulations

1.4. Capabilities of MD for nanoscale material removal process analysis

1.5. Advances and recent developments in material removal process simulation

1.6. Summary and outlook

1.7. References

Chapter 2. Ductile Mode Cutting of Brittle Materials: Mechanism, Chip Formation and Machined Surfaces

2.1. Introduction

2.2. The mechanism of ductile mode cutting of brittle materials

2.3. The chip formation in cutting of brittle materials

2.4. Machined surfaces in relation to chip formation mode

2.5. References

Chapter 3. Diamond Tools in Micromachining

3.1. Introduction

3.2. Diamond technology

3.3. Preparation of substrate

3.4. Modified HFCVD process

3.5. Nucleation and diamond growth

3.6. Deposition on complex substrates

3.7. Diamond micromachining

3.8. Conclusions

3.9. References

Chapter 4. Conventional Processes: Microturning, Microdrilling and Micromilling

4.1. Introduction

4.2. Microturning

4.3. Microdrilling

4.4. Micromilling

4.5. Product quality in micromachining

4.6. References

Chapter 5. Microgrinding and Ultra-precision Processes

5.1. Introduction

5.2. Micro and nanogrinding

5.3. Nanogrinding tools

5.4. Conclusions

5.5. References

Chapter 6. Non-Conventional Processes: Laser Micromachining

6.1. Introduction

6.2. Fundamentals of lasers

6.3. Laser microfabrication

6.4. Laser nanofabrication

6.5. Conclusions

6.6. References

Chapter 7. Evaluation of Subsurface Damage in Nano and Micromachining

7.1. Introduction

7.2. Destructive evaluation technologies

7.3. Non-destructive evaluation technologies

7.4. Acknowledgements

7.5. References

Chapter 8. Applications of Nano and Micromachining in Industry

8.1. Introduction

8.2. Typical machining methods

8.3. Applications in optical manufacturing

8.4. Semiconductor and electronics related applications

8.5. Summary

8.6. Acknowledgements

8.7. References

List of Authors

Index

First published in Great Britain and the United States in 2009 by ISTE Ltd and John Wiley & Sons, Inc.

Apart from any fair dealing for the purposes of research or private study, or criticism or review, as permitted under the Copyright, Designs and Patents Act 1988, this publication may only be reproduced, stored or transmitted, in any form or by any means, with the prior permission in writing of the publishers, or in the case of reprographic reproduction in accordance with the terms and licenses issued by the CLA. Enquiries concerning reproduction outside these terms should be sent to the publishers at the undermentioned address:

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© ISTE Ltd, 2009

The rights of J. Paulo Davim and Mark J. Jackson to be identified as the authors of this work have been asserted by them in accordance with the Copyright, Designs and Patents Act 1988.

Library of Congress Cataloging-in-Publication Data

Nano and micromachining / Edited by J. Paulo Davim, Mark J. Jackson.

p. cm.

Includes bibliographical references and index.ISBN 978-1-84821-103-21. Nanotechnology. 2. Micromachining. I. Davim, J. Paulo. II. Jackson, Mark J.T174.7.N33 2008620’.5--dc22

2008037127

British Library Cataloguing-in-Publication Data

A CIP record for this book is available from the British Library

ISBN: 978-1-84821-103-2

Preface

At this moment in time, it is difficult to obtain an exact definition of nano and micromachining. Nanomachining is a recent nanotechnology that involves changing the structure of nano-scale materials or molecules. The Institute of Nanotechnology (UK) defines nanotechnology as “science and technology where dimensions and tolerances in the range of 0.1 nanometer (nm) to 100 nm play a critical role”. Micromachining (performing various cutting processes or grinding operations on workpiece in micro-scale) covers techniques used, for example, in manufacturing the miniaturized devices and moving parts into which microelectronic circuitry is integrated. Unlike micromachining, where portions of the structure are removed or modified, nanomachining involves only changing the structure of nanoscale materials or molecules.

This book aims to provide the fundamentals and the recent advances in nano and micromachining for modern manufacturing and engineering.

Chapter 1 provides the fundamentals of molecular dynamics for nanoscale cutting. Chapter 2 contains information on ductile mode cutting of brittle materials and generic descriptions of the significant aspects involved – mechanism, chip formation and machined surfaces. Chapter 3 covers diamond tools used in micromachining. Chapters 4 and 5 contain information on convention machining processes, microturning, microdrilling, micromilling, microgrinding and ultra-precision processes. Chapter 6 focuses on a non-conventional process – laser micromachining. Chapter 7 covers the evaluation of subsurface damage in nano and micromachining. Finally, Chapter 8 is dedicated to applications of nano and micromachining in industry.

The present book can be used as a textbook for a final year undergraduate engineering course or specifically for nano and micromanufacturing (machining) at postgraduate level. Also, this book can serve as a useful reference for academics, manufacturing and materials researchers, manufacturing and mechanical engineers, as well as professionals in nano and micromanufacturing and related industries. The scientific interest of this book is evident for many important research centers, laboratories and universities in the world. Therefore, it is hoped that this book will encourage and enthuse other research in this recent field of science and technology.

The editors acknowledge their gratitude to ISTE-Wiley for this opportunity and for their professional support. Finally, we would like to thank all the chapter authors for their availability for this work.

J. Paulo DavimUniversity of Aveiro, PortugalOctober 2008

Mark J. JacksonPurdue University, USAOctober 2008

Chapter 1

Nanoscale Cutting1

1.1. Introduction

In nano and micromachining processes the actual material removal can be limited to the surface of the workpiece, i.e. only a few atoms or layers of atoms. At this range, inherent measurement problems and the lack of more detailed experimental data limit the possibility for developing analytical and empirical models as more assumptions have to be made. On the basis of atomistic contact models, the dynamics of the local material removal process and its impact on the material structure, as well as the surface generation, can be studied.

The first pioneering applications in molecular dynamics (MD) indentation and material removal simulation were published between 1989 and 1991 [BEL 91, IKA 91, HOO 90, LAN 89]. By starting at the atomic level, the considered microscopic material properties and the underlying constitutive physical equations of state in MD provide, in principle, a sufficiently detailed and consistent description of the micromechanical and thermal state of the modeled material to allow for the investigation of the local tool tip/workpiece contact dynamics [HOO 91, RAP 95]. The description of microscopic material properties considers, e.g., the microstructure, lattice constants and orientation, chemical elements and the atomic interactions.

The more universal material representation in MD further allows us to go beyond ideal, single crystalline structures and to also consider polycrystals, defect structures, pre-machined or otherwise constrained workpiece models and non-smooth surfaces [DAW 84, REN 95-1, REN 95-3, YIP 89]. Various application-specific boundary conditions may be applied [HOO 91, RAP 95, YIP 89]. In recent years the number of applications considering quantum mechanics for the interactions between atoms has been steadily increasing. However, here only the more classical atomistic approach will be presented.