Resonant MEMS E-Book

• Herausgeber: Wiley-VCH
• Kategorie: Wissenschaft und neue Technologien
• Serie: Advanced Micro and Nanosystems
• Sprache: Englisch

Seitenzahl: 880

Veröffentlichungsjahr: 2015

Beschreibung

Part of the AMN book series, this book covers the principles, modeling and implementation as well as applications of resonant MEMS from a unified viewpoint. It starts out with the fundamental equations and phenomena that govern the behavior of resonant MEMS and then gives a detailed overview of their implementation in capacitive, piezoelectric, thermal and organic devices, complemented by chapters addressing the packaging of the devices and their stability. The last part of the book is devoted to the cutting-edge applications of resonant MEMS such as inertial, chemical and biosensors, fluid properties sensors, timing devices and energy harvesting systems.

Leseprobe

Table of Contents

Cover

Related Titles

Title Page

Copyright

Series Editor Preface

Preface

About the Volume Editors

List of Contributors

Part I: Fundamentals

Chapter 1: Fundamental Theory of Resonant MEMS Devices

1.1 Introduction

1.2 Nomenclature

1.3 Single-Degree-of-Freedom (SDOF) Systems

1.4 Continuous Systems Modeling: Microcantilever Beam Example

1.5 Formulas for Undamped Natural Frequencies

1.6 Summary

Acknowledgment

References

Chapter 2: Frequency Response of Cantilever Beams Immersed in Viscous Fluids

2.1 Introduction

2.2 Low Order Modes

2.3 Arbitrary Mode Order

References

Chapter 3: Damping in Resonant MEMS

3.1 Introduction

3.2 Air Damping

3.3 Surface Damping

3.4 Anchor Damping

3.5 Electrical Damping

3.6 Thermoelastic Dissipation (TED)

3.7 Akhiezer Effect (AKE)

References

Chapter 4: Parametrically Excited Micro- and Nanosystems

4.1 Introduction

4.2 Sources of Parametric Excitation in MEMS and NEMS

4.3 Modeling the Underlying Dynamics – Variants of the Mathieu Equation

4.4 Perturbation Analysis

4.5 Linear, Steady-State Behaviors

4.6 Sources of Nonlinearity and Nonlinear Steady-State Behaviors

4.7 Complex Dynamics in Parametrically Excited Micro/Nanosystems

4.8 Combined Parametric and Direct Excitations

4.9 Select Applications

4.10 Some Parting Thoughts

Acknowledgment

References

Chapter 5: Finite Element Modeling of Resonators

5.1 Introduction to Finite Element Analysis

5.2 Application of FEA in MEMS Resonator Design

5.3 Summary

References

Part II: Implementation

Chapter 6: Capacitive Resonators

6.1 Introduction

6.2 Capacitive Transduction

6.3 Electromechanical Actuation

6.4 Capacitive Sensing and Motional Capacitor Topologies

6.5 Electrical Isolation

6.6 Capacitive Resonator Circuit Models

6.7 Capacitive Interfaces

6.8 Conclusion

Acknowledgment

References

Chapter 7: Piezoelectric Resonant MEMS

7.1 Introduction to Piezoelectric Resonant MEMS

7.2 Fundamentals of Piezoelectricity and Piezoelectric Resonators

7.3 Thin Film Piezoelectric Materials for Resonant MEMS

7.4 Equivalent Electrical Circuit of Piezoelectric Resonant MEMS

7.5 Examples of Piezoelectric Resonant MEMS: Vibrations in Beams, Membranes, and Plates

7.6 Conclusions

References

Chapter 8: Electrothermal Excitation of Resonant MEMS

8.1 Basic Principles

8.2 Actuator Implementations

8.3 Piezoresistive Sensing

8.4 Modeling and Optimization of Single-Port Thermal-Piezoresistive Resonators

8.5 Examples of Thermally Actuated Resonant MEMS

References

Chapter 9: Nanoelectromechanical Systems (NEMS)

9.1 Introduction

9.2 Carbon-Based NEMS

9.3 Toward Functional Bio-NEMS

9.4 Summary and Outlook

References

Chapter 10: Organic Resonant MEMS Devices

10.1 Introduction

10.2 Device Designs

10.3 Quality Factor of Polymeric Micromechanical Resonators

10.4 Applications

References

Chapter 11: Devices with Embedded Channels

11.1 Introduction

11.2 Theory

11.3 Device Technology

11.4 Applications

11.5 Conclusion

References

Chapter 12: Hermetic Packaging for Resonant MEMS

12.1 Introduction

12.2 Overview of Packaging Types

12.3 Die-Level Vacuum-Can Packaging

12.4 Wafer Bonding for Device Packaging

12.5 Thin Film Encapsulation-Based Packaging

12.6 Getters

12.7 The “Stanford epi-Seal Process” for Packaging of MEMS Resonators

12.8 Conclusion

References

Chapter 13: Compensation, Tuning, and Trimming of MEMS Resonators

13.1 Introduction

13.2 Compensation Techniques in MEMS Resonators

13.3 Tuning Methods in MEMS Resonators

13.4 Trimming Methods

References

Part III: Application

Chapter 14: MEMS Inertial Sensors

14.1 Introduction

14.2 Accelerometers

14.3 Gyroscopes

14.4 Multi-degree-of-Freedom Inertial Measurement Units

References

Chapter 15: Resonant MEMS Chemical Sensors

15.1 Introduction

15.2 Modeling of Resonant Microcantilever Chemical Sensors

15.3 Effects of Chemical Analyte Sorption into the Coating

15.4 Figures of Merit

15.5 Chemically Sensitive Layers

15.6 Packaging

15.7 Gas-Phase Chemical Sensors

15.8 Liquid-Phase Chemical Sensors

References

Chapter 16: Biosensors

16.1 Introduction

16.2 Design Considerations: Length Scale, Geometry, and Materials

16.3 Surface Functionalization: Preparation, Passivation, and Bio-recognition

16.4 Biosensing Application Formats

16.5 Application Case Studies

16.6 Conclusions and Future Trends

Acknowledgment

References

Chapter 17: Fluid Property Sensors

17.1 Introduction

17.2 Definition of Fluid Properties

17.3 Resonator Sensors

17.4 Examples of Resonant Sensors for Fluid Properties

17.5 Conclusions

References

Chapter 18: Energy Harvesting Devices

18.1 Introduction

18.2 Generic Harvester Structures

18.3 MEMS Energy Harvester Transduction Mechanisms

18.4 Review and Comparison of MEMS Energy Harvesting Devices

18.5 Conclusions

References

Index

End User License Agreement

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Guide

Cover

Table of Contents

Preface

Part I: Fundamentals

Begin Reading

List of Illustrations

Figure 1.1

Figure 1.2

Figure 1.3

Figure 1.4

Figure 1.5

Figure 1.6

Figure 1.7

Figure 1.8

Figure 1.9

Figure 2.1

Figure 2.2

Figure 2.3

Figure 2.4

Figure 2.5

Figure 2.6

Figure 2.7

Figure 3.1

Figure 3.2

Figure 3.3

Figure 3.4

Figure 3.5

Figure 3.6

Figure 3.7

Figure 3.8

Figure 3.9

Figure 3.10

Figure 4.1

Figure 4.2

Figure 4.3

Figure 5.1

Figure 5.2

Figure 5.3

Figure 5.4

Figure 5.5

Figure 5.6

Figure 5.7

Figure 5.8

Figure 5.9

Figure 5.10

Figure 5.11

Figure 5.12

Figure 5.13

Figure 5.14

Figure 5.15

Figure 5.16

Figure 5.17

Figure 5.18

Figure 5.19

Figure 6.1

Figure 6.2

Figure 6.3

Figure 6.4

Figure 6.5

Figure 6.6

Figure 6.7

Figure 6.8

Figure 6.9

Figure 6.10

Figure 6.11

Figure 6.12

Figure 6.13

Figure 6.14

Figure 6.15

Figure 6.16

Figure 6.17

Figure 7.1

Figure 7.2

Figure 7.3

Figure 7.4

Figure 7.5

Figure 7.6

Figure 7.7

Figure 7.8

Figure 7.9

Figure 7.10

Figure 7.11

Figure 7.12

Figure 7.13

Figure 8.1

Figure 8.2

Figure 8.3

Figure 8.4

Figure 8.5

Figure 8.6

Figure 8.7

Figure 8.8

Figure 8.9

Figure 8.10

Figure 8.11

Figure 8.12

Figure 8.13

Figure 8.14

Figure 8.15

Figure 8.16

Figure 8.17

Figure 9.1

Figure 9.2

Figure 9.3

Figure 9.4

Figure 9.5

Figure 9.6

Figure 9.7

Figure 9.8

Figure 9.9

Figure 9.10

Figure 9.11

Figure 9.12

Figure 10.1

Figure 10.2

Figure 10.3

Figure 10.4

Figure 10.5

Figure 10.6

Figure 10.7

Figure 10.8

Figure 10.9

Figure 10.10

Figure 10.11

Figure 10.12

Figure 10.13

Figure 10.14

Figure 10.15

Figure 10.16

Figure 10.17

Figure 10.18

Figure 10.19

Figure 11.1

Figure 11.2

Figure 11.3

Figure 11.4

Figure 11.5

Figure 11.6

Figure 11.7

Figure 11.8

Figure 12.1

Figure 12.2

Figure 12.3

Figure 12.4

Figure 12.5

Figure 12.6

Figure 12.7

Figure 13.1

Figure 13.2

Figure 13.3

Figure 13.4

Figure 13.5

Figure 13.6

Figure 13.7

Figure 13.8

Figure 13.9

Figure 13.10

Figure 13.11

Figure 13.12

Figure 13.13

Figure 13.14

Figure 13.15

Figure 13.16

Figure 13.17

Figure 13.18

Figure 14.1

Figure 14.2

Figure 14.3

Figure 14.4

Figure 14.5

Figure 14.6

Figure 14.7

Figure 14.8

Figure 14.9

Figure 14.10

Figure 14.11

Figure 14.12

Figure 14.13

Figure 14.14

Figure 14.15

Figure 14.16

Figure 14.17

Figure 14.18

Figure 15.1

Figure 15.2

Figure 15.3

Figure 15.4

Figure 15.5

Figure 15.6

Figure 15.7

Figure 16.1

Figure 16.2

Figure 16.3

Figure 16.4

Figure 16.5

Figure 17.1

Figure 17.2

Figure 18.1

Figure 18.2

Figure 18.3

Figure 18.4

Figure 18.5

Figure 18.6

Figure 18.7

Figure 18.8

Figure 18.9

Figure 18.10

List of Tables

Table 1.1

Table 1.2

Table 1.3

Table 2.1

Table 3.1

Table 4.1

Table 7.1

Table 8.1

Table 8.2

Table 11.1

Table 11.2

Table 12.1

Table 15.1

Table 15.2

Table 15.3

Table 16.1

Table 16.4

Table 17.1

Table 17.2

Table 18.1

Table 18.2

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Edited by Oliver Brand, Isabelle Dufour, Stephen M. Heinrich, and Fabien Josse

Resonant MEMS

Fundamentals, Implementation and Application

The Editor

Prof. Oliver Brand

School Electrical/Comp.Eng.

Georgia Inst. of Technology

777 Atlantic Drive

Atlanta, GA

United States

Prof. Isabelle Dufour

Université de Bordeaux

Laboratoire IMS

Bâtiment CBP

16 av. Pey Berland

33607 Pessac cedex

France

Prof. Stephen M. Heinrich

Marquette University

Civil, Construction and Environmental Engineering

Haggerty Hall 265

Milwaukee, WI

United States

Prof. Fabien Josse

Marquette University

Electrical & Computer Eng.

Haggerty Hall 294

Milwaukee, WI

United States

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Print ISBN: 978-3-527-33545-9

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Series Editor Preface

You hold in your hands the eleventh volume of our book series Advanced Micro & Nanosystems, dedicated to the field of Resonant MEMS. We have been very fortunate to enlist Prof. Oliver Brand, Prof. Isabelle Dufour, Prof. Stephen Heinrich, and Prof. Fabien Josse as Volume Editors. All four have extensive expertise in different aspects of Resonant MEMS and, as a team, actually have collaborated in recent years, resulting in a number of joint research publications. In a similar way, this book project turned out to be a true team project, from establishing the desired table of contents; to selecting an international team of experts as chapter authors; to assembling, editing, and fine-tuning the contents.

You might ask, why a book on Resonant MEMS? Clearly, resonant devices fabricated using MEMS (MicroElectroMechanical Systems) technologies are not new; in fact, one of the early MEMS devices is the Resonant Gate Transistor, published by Harvey C. Nathanson and co-workers in the IEEE Transactions on Electron Devices in 1967. Over the years, a resonant sensor version of just about every sensor imaginable has been investigated. In general, Resonant MEMS (and in particular resonant sensors) promise very high sensitivities, but often come at the expense of a more complicated device design and fabrication. In recent years, modern numerical modeling tools, in particular finite element modeling (FEM) software, and a number of fundamental theoretical studies have helped design better Resonant MEMS, and, as a result, first commercial devices based on Resonant MEMS have been developed. The best example might be the success of MEMS-based resonant gyroscopes in consumer electronic devices, such as smart phones and gaming consoles. As the field matures, we found a book that summarizes all aspects of Resonant MEMS, ranging from the Fundamentals to Implementation and Application, to be very timely. You have the result in your hands, and we hope that you enjoy reading this book as much as we do.

This book would not have been possible without a significant time commitment by the volume editors as well as the chapter authors. We want to thank them most heartily for their effort! Our thanks also go to the Wiley staff for their strong support of this project. The final printed result once again speaks for itself!

Oliver Brand, Gary K. Fedder,

Christofer Hierold, Jan G. Korvink,

Osamu Tabata, Series Editors

Atlanta, Pittsburgh,

Zurich, Freiburg,

Kyoto, January 2015

Preface

As the editing team for Vol. 11 of the Advanced Micro & Nanosystems series, entitled Resonant MEMS: Fundamentals, Implementation and Application, we hope that you benefit from this significant collaborative effort among the experts who have kindly contributed to this project. The book's raison d'être is to elucidate the various aspects of MEMS resonators, to identify the state of the art in this rapidly changing field, and to serve as a valuable reference tool to the readership, including serving as a springboard for future advances in this discipline.

Given the breadth of the resonant MEMS field, we have elected to group the various chapters of this volume into three parts as indicated by the book's subtitle. Part I, Fundamentals, comprises five chapters, each of which focuses on the theoretical description of the underlying physical phenomena that are relevant to virtually all resonant MEMS devices. This part includes detailed treatments on the fundamental theory of mechanical resonance; the effects of viscous fluids (a surrounding gas or liquid) on vibrating microcantilevers; a broad-based examination of various sources of damping (energy dissipation mechanisms); resonant response caused by parametric excitation, i.e., variations in resonator properties as opposed to direct (e.g., force) excitation; and an overview of the fundamentals of the finite element method with specific applications to MEMS resonators. Having laid the fundamental groundwork in Part I, the eight chapters of Part II, Implementation, examine how the fundamentals are applied in a practical setting to yield specific types of resonant MEMS devices and how these devices are designed to reliably perform a specific function. In particular, this group of chapters includes detailed discussions of resonant MEMS devices on the basis of the following materials and device designs: capacitive transducers, piezoelectric materials, nanoelectromechanical systems (NEMS), and organic materials (polymers). Also included in Part II are chapters treating the following practical implementation topics: electrothermal excitation methods; the use of embedded channels to overcome challenges posed by liquid-phase applications; hermetic packaging to protect the resonator and to ensure its long-term stability and reliability; and the development of compensation, tuning, and trimming techniques for the realization of high-precision resonators by accounting for variations in material properties, fabrication processes, and environmental operating conditions. Finally, in Part III, Application, we have included chapters that are dedicated to particular functionalities. Part III comprises four chapters on resonant MEMS for sensing applications, including the following: inertial sensing (motion detection); chemical detection in both gaseous and liquid environments; biochemical sensing for label-free, quantitative measurement of biomolecules such as proteins and nucleic acids, or even entire cells and viruses; and resonant MEMS-based rheometers for measuring the physical properties of fluids. The final chapter of Part III focuses on energy harvesting applications for converting ambient mechanical vibrations into useful electrical energy.

Finally, we would like to extend a sincere expression of gratitude to all of the chapter authors and their associated institutions, to the editorial staff at Wiley-VCH, especially Martin Preuss and Martin Graf-Utzmann, and to Sangeetha Suresh and the production staff at Laserwords. Without the tireless efforts of all of these people, this book would not have been possible. Also, all four co-editors gratefully acknowledge the financial support of CNRS (France, Projet PICS, 2012–2014) for the international collaboration required to plan and realize this volume, while three of the co-editors (Brand, Heinrich, Josse) gratefully acknowledge research funding from the National Science Foundation (U.S.) over the period 2008–present. The support provided by both of these funding agencies was instrumental in bringing this book to fruition.

Oliver Brand

Isabelle Dufour

Stephen M. Heinrich

Fabien Josse

Co-Editors

Atlanta, Pessac,

Milwaukee, January 2015

About the Volume Editors

Oliver Brand, PhD Oliver Brand received his diploma degree in Physics from Technical University Karlsruhe, Germany, in 1990 and his PhD degree from ETH Zurich, Switzerland, in 1994. From 1995 to 1997, he worked as a postdoctoral fellow at Georgia Tech. From 1997 to 2002, he was a lecturer at ETH Zurich and deputy director of the Physical Electronics Laboratory. In 2003, he joined the Electrical and Computer Engineering faculty at the Georgia Institute of Technology where he is currently a Professor. Since 2014, he serves as the Executive Director of Georgia Tech's Institute for Electronics and Nanotechnology. He has co-authored more than 190 publications in scientific journals and conference proceedings. He is a co-editor of the Wiley-VCH book series Advanced Micro & Nanosystems , a member of the editorial board of Sensors and Materials, and has served as General Co-Chair of the 2008 IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2008). Dr. Brand is a senior member of the IEEE and a co-recipient of the 2005 IEEE Donald G. Fink Prize Paper Award. His research interests are in the areas of silicon-based microsystems, microsensors, MEMS fabrication technologies, and microsystem packaging.

Isabelle Dufour, PhD Isabelle Dufour graduated from Ecole Normale Supérieure de Cachan in 1990 and received her PhD and HDR degrees in engineering science from the University of Paris-Sud, Orsay, France, in 1993 and 2000, respectively. She was a CNRS research fellow from 1994 to 2007, first in Cachan working on the modeling of electrostatic actuators (micromotors, micropumps) and then after 2000 in Bordeaux working on microcantilever-based chemical sensors. She is currently a Professor of electrical engineering at the University of Bordeaux, and her research interests are in the areas of microcantilever-based sensors for chemical detection, rheological measurements, material characterization, and energy harvesting.

Stephen M. Heinrich, PhD Stephen M. Heinrich earned the BS degree summa cum laude from Penn State in 1980 and the MS and PhD degrees from the University of Illinois at Urbana-Champaign in 1982 and 1985, all in civil engineering. Hired as an Assistant Professor at Marquette University in 1985, he was promoted to his current rank of Professor in 1998. In 2000, Prof. Heinrich was awarded the Rev. John P. Raynor Faculty Award for Teaching Excellence, Marquette's highest teaching honor, while in 2006 he was a awarded a Fulbright Research Scholar Award to support research collaboration at the Université de Bordeaux. Dr. Heinrich's research has focused on structural mechanics applications in microelectronics packaging and analytical modeling of cantilever-based chemical/biosensors and, more recently, MEMS energy harvesters. The investigations performed by Dr. Heinrich and his colleagues have resulted in more than 100 refereed publications and three best paper awards from IEEE and ASME. His professional service activities include membership on the ASCE Elasticity Committee, Associate Editor positions for the IEEE Transactions on Advanced Packaging and the ASME Journal of Electronic Packaging, and technical review activities for more than 40 journals, publishers, and funding agencies.

Fabien Josse, PhD Fabien Josse received the MS and PhD degrees in Electrical Engineering from the University of Maine in 1979 and 1982, respectively. He has been with Marquette University, Milwaukee, WI, since 1982 and is currently Professor of Electrical, Computer and Biomedical Engineering. He is also an Adjunct Professor with the Department of Electrical Engineering, Laboratory for Surface Science and Technology, University of Maine. He has been a Visiting Professor with the University of Heidelberg, Germany, the Laboratoire IMS, University of Bordeaux, France, and the Physical Electronics Laboratory, ETH Zurich, Switzerland, and IMTEK, University of Freiburg, Germany. His research interests include solid state sensors, acoustic wave sensors, and MEMS devices for liquid-phase biochemical sensor applications, investigation of novel sensor platforms, and smart sensor systems. Prof. Josse is a senior member of IEEE and associate editor (2002–2009) of the IEEE Sensors Journal.

List of Contributors

Gabriel Abadal

Universitat AutonÒma de Barcelona (UAB)

Escola d'Enginyeria

Department d'Enginyeria ElectrÒnica

Campus UAB 08193

Bellaterra

Spain

Reza Abdolvand

University of Central Florida

Department of Electrical Engineering and Computer Sciences

4000 Central Florida Blvd.

Building 116 – Room 346

Orlando, FL 32816-2362

USA

Vaida Auzelyte

Microsystem Laboratory

Ecole Polytechnique Federal de Lausanne (EPFL)

EPFL STI IMT IMT-LS-GE

BM 3107 (Batiment BM)

Station 17, 1015 Lausanne

Switzerland

Farrokh Ayazi

Georgia Institute of Technology

School of Electrical and Computer Engineering

777 Atlantic Drive

Atlanta, GA 30332-0250

USA

and

Qualtré Inc

225 Cedar Hill St

Marlborough, MA 01752

USA

N. Barniol

Universitat AutonÒma de Barcelona (UAB)

Escola d'Enginyeria

Department d'Enginyeria ElectrÒnica

Campus UAB 08193

Bellaterra

Spain

Luke A. Beardslee